17988469. APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING THE SAME
Organization Name
Inventor(s)
Euisun Choi of Hwaseong-si (KR)
Hyeonggyun Cheong of Suwon-si (KR)
APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17988469 titled 'APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING THE SAME
Simplified Explanation
The abstract describes a chip bonding apparatus that is used to attach a chip to a substrate. The apparatus includes a body, a substrate conveyor, a bonding head conveyor, an alignment unit, and a bonding head. The bonding head has a chip bonding unit for attaching the chip.
- The chip bonding apparatus is used to attach a chip to a substrate.
- The apparatus includes a body, a substrate conveyor, a bonding head conveyor, an alignment unit, and a bonding head.
- The alignment unit adjusts the position of the substrate and the chip.
- The bonding head is installed in the bonding head conveyor and moves to attach the chip.
- The chip bonding unit in the bonding head attaches the chip to the substrate.
- The chip bonding unit includes a chip bonding unit body, a pushing module, and an attachment module.
- The pushing module deforms a member in the attachment module.
- The deformed member exerts a force on the chip to bond it to the substrate.
Potential Applications
- Semiconductor manufacturing
- Electronics assembly
- Microchip production
Problems Solved
- Efficient and accurate chip bonding
- Alignment of chip and substrate
- Secure attachment of chip to substrate
Benefits
- Improved productivity in chip bonding process
- Precise alignment of chip and substrate
- Reliable and strong bond between chip and substrate
Original Abstract Submitted
A chip bonding apparatus, includes: a body; a substrate conveyor installed on the body to transfer a substrate; a bonding head conveyor disposed on an upper surface of the body; an alignment unit installed on the body and adjusting a position of the substrate and a position of a chip; and a bonding head installed in the bonding head conveyor and moved and attaching a chip therebelow, wherein the bonding head is provided with a chip bonding unit for attaching the chip in a lower end portion thereof, wherein the chip bonding unit, includes: a chip bonding unit body having an installation groove formed therein; a pushing module having one end portion inserted in the installation groove; and an attachment module having a deformable member deformed by the pushing module; wherein the deformable member is provided with a deformable portion which is deformed by being pressed by the pushing module, and having a bottom surface in contact and exerting a force on the chip to bond the chip to the substrate.
