17973316. WAFER-LEVEL BOND STRENGTH MEASUREMENT simplified abstract (Intel Corporation)
Contents
- 1 WAFER-LEVEL BOND STRENGTH MEASUREMENT
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 WAFER-LEVEL BOND STRENGTH MEASUREMENT - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
WAFER-LEVEL BOND STRENGTH MEASUREMENT
Organization Name
Inventor(s)
Khaled Ahmed of San Jose CA (US)
WAFER-LEVEL BOND STRENGTH MEASUREMENT - A simplified explanation of the abstract
This abstract first appeared for US patent application 17973316 titled 'WAFER-LEVEL BOND STRENGTH MEASUREMENT
Simplified Explanation
The patent application describes a device for measuring bond strength, which includes a plate with a sticky probe and a mirror, as well as an optical fiber sensor assembly for sending and receiving light.
- The device comprises a plate with three portions: one connected to a movement mechanism, one with a sticky probe, and one with a mirror.
- An optical fiber sensor assembly is included, with a bundle for sending light through one fiber and receiving reflected light through another fiber.
Potential Applications
This technology could be used in industries where bond strength measurement is critical, such as construction, aerospace, and automotive.
Problems Solved
This device provides a more accurate and reliable way to measure bond strength compared to traditional methods, which may be subjective or less precise.
Benefits
The device offers a non-destructive method of testing bond strength, allowing for quality control and assurance in various applications.
Potential Commercial Applications
"Advanced Bond Strength Measurement Device for Industrial Use" - This technology could be marketed to companies in industries where bond strength is a crucial factor in product performance and safety.
Possible Prior Art
There may be existing devices or methods for measuring bond strength, but the specific combination of a plate with a sticky probe, mirror, and optical fiber sensor assembly may be unique to this patent application.
Unanswered Questions
How does this device compare to existing bond strength measurement tools?
This article does not provide a direct comparison to other devices or methods currently used for measuring bond strength.
What are the limitations of this technology in real-world applications?
The article does not address any potential challenges or constraints that may arise when using this device in practical settings.
Original Abstract Submitted
This disclosure describes systems, methods, and devices related to bond strength measurement. A device may comprise a first portion of a plate connected to a movement mechanism, a second portion of the plate comprising a sticky probe and a third portion of the plate comprising a mirror with a reflective side pointing outwards. The device may further comprise an optical fiber sensor assembly comprising an optical fiber bundle for sending light through a first optical fiber and receiving light reflected from the mirror through a second optical fiber.
