17972923. COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE simplified abstract (Intel Corporation)

COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE

Organization Name

Intel Corporation

Inventor(s)

Min Suet Lim of Gelugor (MY)

Telesphor Kamgaing of Chandler AZ (US)

Ilan Ronen of Hadera (IL)

Kavitha Nagarajan of Bangalore KA (IN)

Chee Kheong Yoon of Beyan Lepas (MY)

Chu Aun Lim of Hillsboro OR (US)

Eng Huat Goh of Penang (MY)

Jooi Wah Wong of Bukit Mertajam (MY)

COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE - A simplified explanation of the abstract

This abstract first appeared for US patent application 17972923 titled 'COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE

Simplified Explanation

The abstract describes an integrated circuit device with semiconductor devices positioned near the center of the device to trap heat, and metal fill like copper to transfer heat away from the semiconductor devices towards a heat spreader.

• Integrated circuit devices with semiconductor devices positioned near the center of the device
• Metal fill, such as copper, formed over the semiconductor devices and front side interconnect structures
• Metal fill used to transfer heat away from the semiconductor devices towards a heat spreader

Potential Applications

The technology described in this patent application could be applied in various electronic devices where efficient heat dissipation is crucial, such as:

• High-performance computing systems
• Mobile devices
• Automotive electronics

Problems Solved

This technology addresses the issue of heat buildup in integrated circuit devices by strategically placing semiconductor devices and utilizing metal fill to transfer heat away, improving overall device performance and reliability.

Benefits

The benefits of this technology include:

• Improved thermal management
• Enhanced device performance and reliability
• Increased lifespan of integrated circuit devices

Potential Commercial Applications

The technology could find commercial applications in industries such as:

• Electronics manufacturing
• Semiconductor fabrication
• Consumer electronics production

Possible Prior Art

One possible prior art could be the use of heat sinks or heat spreaders in electronic devices to manage heat dissipation. However, the specific arrangement of semiconductor devices near the center of the device and the use of metal fill for heat transfer may be novel aspects of this technology.

How does this technology compare to traditional heat dissipation methods in integrated circuit devices?

This article does not provide a direct comparison between this technology and traditional heat dissipation methods, leaving the reader to wonder about the efficiency and effectiveness of this new approach.

What are the potential challenges or limitations of implementing this technology in practical applications?

The article does not address any potential challenges or limitations that may arise when implementing this technology in real-world electronic devices, leaving room for speculation on the feasibility and scalability of the innovation.

Original Abstract Submitted

Described herein are integrated circuit devices that include semiconductor devices near the center of the device, rather than towards the top or bottom of the device. In this arrangement, heat can become trapped inside the device. Metal fill, such as copper, is formed within a portion of the device, e.g., over the semiconductor devices and any front side interconnect structures, to transfer heat away from the semiconductor devices and towards a heat spreader.