17971358. SCALABLE COOLING ARCHITECTURE FOR LIQUID AND AIR INTAKE AIR COOLING MODULES simplified abstract (Dell Products L.P.)

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SCALABLE COOLING ARCHITECTURE FOR LIQUID AND AIR INTAKE AIR COOLING MODULES

Organization Name

Dell Products L.P.

Inventor(s)

Tyler Baxter Duncan of Austin TX (US)

Anthony Middleton of Cedar Park TX (US)

Ty Robert Schmitt of Round Rock TX (US)

SCALABLE COOLING ARCHITECTURE FOR LIQUID AND AIR INTAKE AIR COOLING MODULES - A simplified explanation of the abstract

This abstract first appeared for US patent application 17971358 titled 'SCALABLE COOLING ARCHITECTURE FOR LIQUID AND AIR INTAKE AIR COOLING MODULES

Simplified Explanation

The patent application describes a system for providing liquid and air cooling for IT components in a facility, utilizing a module with dry coolers and liquid heat exchange devices in primary and secondary cooling loops.

  • The system includes at least one dry cooler and at least one liquid heat exchange device in a module.
  • A primary cooling loop is established with the dry cooler and liquid heat exchange device.
  • A secondary loop includes the liquid heat exchange device and IT units in the facility.
  • Air cooling for the IT units is facilitated by an air intake from outside the facility.

Potential Applications

The technology can be applied in data centers, server rooms, and other facilities housing IT equipment that require efficient cooling solutions.

Problems Solved

This system addresses the challenge of maintaining optimal operating temperatures for IT components, preventing overheating and potential damage.

Benefits

The system provides effective cooling for IT components, potentially extending their lifespan and reducing the risk of downtime due to overheating.

Potential Commercial Applications

Commercial applications include data centers, server farms, and other IT facilities looking to improve their cooling systems for better performance and reliability.

Possible Prior Art

One possible prior art could be traditional air cooling systems used in data centers and server rooms before the development of integrated liquid cooling solutions.

Unanswered Questions

How does the system handle potential leaks in the liquid cooling system?

The patent application does not provide details on how the system addresses potential leaks in the liquid cooling system. This could be a concern for maintenance and system reliability.

What is the energy efficiency comparison between this system and traditional air cooling methods?

The patent application does not discuss the energy efficiency of the system compared to traditional air cooling methods. Understanding the energy consumption and cost savings potential would be valuable for potential users.


Original Abstract Submitted

Systems, devices, and methods for providing liquid and air cooling for IT components in a facility is disclosed. The system includes a module comprising at least one dry cooler and at least one liquid heat exchange device. The module includes a primary cooling loop with the at least one dry cooler and the at least one liquid heat exchange device. The system also includes a secondary loop that includes the at least one liquid heat exchange device and one or more IT units in the facility. The system includes a path for air cooling the one or more IT units in the facility that includes an air intake from outside the facility that supplies air for cooling the one or more IT units. The method includes adjusting a first valve controlling liquid flow in a primary loop and adjusting a second valve controlling liquid flow in a secondary loop.