17971348. STANDALONE AND SCALABLE LIQUID COOLING MODULES simplified abstract (Dell Products L.P.)
Contents
- 1 STANDALONE AND SCALABLE LIQUID COOLING MODULES
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 STANDALONE AND SCALABLE LIQUID COOLING MODULES - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
STANDALONE AND SCALABLE LIQUID COOLING MODULES
Organization Name
Inventor(s)
Tyler Baxter Duncan of Austin TX (US)
Anthony Middleton of Cedar Park TX (US)
STANDALONE AND SCALABLE LIQUID COOLING MODULES - A simplified explanation of the abstract
This abstract first appeared for US patent application 17971348 titled 'STANDALONE AND SCALABLE LIQUID COOLING MODULES
Simplified Explanation
The patent application describes a modular system for cooling Information Technology (IT) components using both liquid and air cooling methods.
- The first module contains at least one dry cooler that provides liquid cooling to liquid heat exchange devices.
- The second module contains at least one liquid heat exchange device that cools the IT units in a facility.
- The system can also supply cooling liquid to an air to liquid heat exchange device in the facility.
Potential Applications
The technology can be applied in data centers, server rooms, and other IT facilities to efficiently cool IT components.
Problems Solved
This system solves the problem of efficiently cooling IT components to prevent overheating and ensure optimal performance.
Benefits
The modular system provides a flexible and efficient cooling solution for IT components, improving their longevity and performance.
Potential Commercial Applications
This technology can be used by IT companies, data centers, and server hosting facilities to enhance the cooling systems of their IT infrastructure.
Possible Prior Art
One possible prior art could be traditional liquid cooling systems for IT components, which may not be as modular or efficient as the system described in the patent application.
Unanswered Questions
1. How does the modular system handle maintenance and repairs? 2. What is the estimated cost of implementing this cooling system compared to traditional methods?
Original Abstract Submitted
Multiple systems for providing liquid and air cooling for IT components is disclosed. The modular system for cooling Information Technology (IT) includes a first module with at least one dry cooler that supplies liquid cooling to at least one liquid heat exchange device, and a second module with at least one liquid heat exchange device that provides liquid cooling to a facility with one or more IT units. The modular system may also provide cooling liquid to an air to liquid heat exchange device of the facility.
