View source for 17971161. SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING simplified abstract (Dell Products L.P.)

=SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING=


==Organization Name==

[[:Category:Dell Products L.P.|Dell Products L.P.]]


[[Category:Dell Products L.P.]]

==Inventor(s)==

[[:Category:Tyler Baxter Duncan of Austin TX (US)|Tyler Baxter Duncan of Austin TX (US)]][[Category:Tyler Baxter Duncan of Austin TX (US)]]

[[:Category:Anthony Middleton of Cedar Park TX (US)|Anthony Middleton of Cedar Park TX (US)]][[Category:Anthony Middleton of Cedar Park TX (US)]]

[[:Category:Ty Robert Schmitt of Round Rock TX (US)|Ty Robert Schmitt of Round Rock TX (US)]][[Category:Ty Robert Schmitt of Round Rock TX (US)]]

==SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17971161 titled 'SYSTEM AND METHOD FOR THERMAL MANAGEMENT USING LIQUID COOLING

==Simplified Explanation==

The patent application describes an information handling system with a liquid cooling system that includes two manifolds to regulate coolant flow within the chassis.

* The first manifold has a chassis outlet providing coolant flow to the chassis inlet, and a chassis inlet receiving coolant flow from the chassis outlet.
* The second manifold also has a chassis outlet providing coolant flow to the chassis inlet, and a chassis inlet receiving coolant flow from the chassis outlet.

== Potential Applications ==
The technology described in this patent application could be applied in high-performance computing systems, data centers, and other electronic devices that require efficient cooling systems to maintain optimal operating temperatures.

== Problems Solved ==
This technology solves the problem of efficiently cooling electronic components within an information handling system to prevent overheating and potential damage to the hardware.

== Benefits ==
The liquid cooling system described in the patent application helps improve the overall performance and longevity of the information handling system by effectively dissipating heat generated by the components.

== Potential Commercial Applications ==
The liquid cooling system technology could be utilized in servers, workstations, gaming PCs, and other electronic devices where heat dissipation is crucial for optimal performance and reliability.

== Possible Prior Art ==
One example of prior art in liquid cooling systems for electronic devices is the use of heat sinks and fans to dissipate heat. However, the specific configuration of the manifolds described in this patent application may be a novel innovation.

== Unanswered Questions ==
=== How does the liquid cooling system impact the overall energy efficiency of the information handling system? ===
The article does not provide information on the energy efficiency implications of the liquid cooling system.

=== Are there any specific maintenance requirements for the liquid cooling system outlined in the patent application? ===
The article does not address any maintenance procedures or requirements for the liquid cooling system.


==Original Abstract Submitted==

An information handling system includes a chassis that includes a chassis inlet and a chassis outlet and a liquid cooling system that includes a first manifold. The first manifold includes a first chassis outlet configured to provide a first inlet coolant flow to the chassis inlet and a first chassis inlet configured to receive a first outlet coolant flow from the chassis outlet. The liquid cooling system also includes a second manifold that includes a second chassis outlet configured to provide the first inlet coolant flow to the chassis inlet, and a second chassis inlet configured to receive the first outlet coolant flow from the chassis outlet.



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