17970348. MODULE-TO-MODULE MECHANICAL, ELECTRICAL, AND AIRFLOW CONNECTIONS IN MODULAR DATA CENTERS simplified abstract (Dell Products L.P.)
Contents
- 1 MODULE-TO-MODULE MECHANICAL, ELECTRICAL, AND AIRFLOW CONNECTIONS IN MODULAR DATA CENTERS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MODULE-TO-MODULE MECHANICAL, ELECTRICAL, AND AIRFLOW CONNECTIONS IN MODULAR DATA CENTERS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MODULE-TO-MODULE MECHANICAL, ELECTRICAL, AND AIRFLOW CONNECTIONS IN MODULAR DATA CENTERS
Organization Name
Inventor(s)
Tyler Baxter Duncan of Austin TX (US)
Anthony Middleton of Cedar Park TX (US)
Jeffery Todd Sayles of San Marcos TX (US)
MODULE-TO-MODULE MECHANICAL, ELECTRICAL, AND AIRFLOW CONNECTIONS IN MODULAR DATA CENTERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17970348 titled 'MODULE-TO-MODULE MECHANICAL, ELECTRICAL, AND AIRFLOW CONNECTIONS IN MODULAR DATA CENTERS
Simplified Explanation
The abstract describes a modular data center comprising a modular information technology component (MITC) with information handling systems (IHSs), a utility control component (UCC), and a first connection interface with mechanical and electrical connection components (MECCOMs). It also includes a modular environmental control component (MECC) with environmental control components (ECCs) and a second connection interface with MECCOMs that pair with the first set to create the data center.
- The modular data center consists of a modular information technology component (MITC) and a modular environmental control component (MECC).
- The MITC includes information handling systems (IHSs) and a utility control component (UCC).
- The MECC includes environmental control components (ECCs) and a second connection interface with MECCOMs that pair with the first set from the MITC.
- The first and second connection interfaces are connected, enclosing an area of equal size to form the modular data center.
Potential Applications
The modular data center technology can be applied in various industries such as telecommunications, cloud computing, and data storage facilities.
Problems Solved
This technology solves the problem of scalability and flexibility in data center infrastructure by allowing for modular expansion and customization.
Benefits
The modular data center offers cost-effective scalability, efficient resource utilization, and simplified maintenance and upgrades.
Potential Commercial Applications
"Modular Data Center Technology: Revolutionizing IT Infrastructure"
Possible Prior Art
One possible prior art is the concept of modular data center containers that have been used in the industry for portable and scalable data center solutions.
Unanswered Questions
How does the modular data center technology impact energy efficiency in comparison to traditional data centers?
The article does not delve into the specific energy efficiency benefits of the modular data center technology.
Are there any limitations or constraints in implementing this modular data center technology in existing infrastructure?
The article does not address any potential challenges or constraints that may arise when integrating this technology into current data center setups.
Original Abstract Submitted
A modular data center includes: a modular information technology component (MITC), in which the MITC includes a plurality of information handling systems (IHSs), a utility control component (UCC), and a first connection interface, in which the first connection interface includes a first set of mechanical and electrical connection components (MECCOMs); and a modular environmental control component (MECC), in which the MECC includes a plurality of environmental control components (ECCs) and a second connection interface, in which the second connection interface includes a second set of MECCOMs to be paired with the first set of MECCOMs to generate at least a portion of the modular data center, and in which the first connection interface is connected to the second connection interface, in which an area enclosed by the first connection interface is equal to an area enclosed by the second connection interface.
