17970310. MOUNTING APPARATUS FOR COMPONENTS WITHOUT MOUNTING POINTS IN MODULAR DATA CENTERS simplified abstract (Dell Products L.P.)

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MOUNTING APPARATUS FOR COMPONENTS WITHOUT MOUNTING POINTS IN MODULAR DATA CENTERS

Organization Name

Dell Products L.P.

Inventor(s)

Tyler Baxter Duncan of Austin TX (US)

Anthony Middleton of Cedar Park TX (US)

MOUNTING APPARATUS FOR COMPONENTS WITHOUT MOUNTING POINTS IN MODULAR DATA CENTERS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17970310 titled 'MOUNTING APPARATUS FOR COMPONENTS WITHOUT MOUNTING POINTS IN MODULAR DATA CENTERS

Simplified Explanation

A modular data center patent application abstract describes a system that includes a modular information technology component (MITC) with a cooling distribution unit (CDU), a floor, a bottom CDU mounting component (CDUMC), a modular over-rack component (MORC), and a top CDUMC. The floor has a floor track apparatus (FTA), the bottom CDUMC attaches the CDU to the FTA, and the top CDUMC attaches the CDU to the MORC while providing air containment within the MITC. Additionally, there is a modular environmental control component (MECC) with multiple environmental control components (ECCs) and built-in airflow connection components to regulate air supply within the MITC.

  • MITC includes CDU, floor, CDUMC, MORC, and top CDUMC
  • Floor has FTA for attachment of CDU by bottom CDUMC
  • Top CDUMC attaches CDU to MORC and provides air containment
  • MECC consists of ECCs and built-in airflow connection components for air regulation

Potential Applications

The modular data center system can be used in various industries such as telecommunications, cloud computing, and data storage facilities.

Problems Solved

This innovation solves the problem of efficiently cooling and controlling the environment within a data center while allowing for modular and scalable expansion.

Benefits

The benefits of this technology include improved energy efficiency, easier maintenance and scalability, better airflow management, and enhanced overall performance of the data center.

Potential Commercial Applications

Potential commercial applications of this technology include data centers, server farms, cloud computing facilities, and telecommunications infrastructure.

Possible Prior Art

One possible prior art could be traditional data center cooling systems that are not modular or scalable, leading to inefficiencies and limitations in expansion capabilities.

Unanswered Questions

How does this modular data center system compare to traditional data center cooling systems in terms of energy efficiency and scalability?

The modular data center system offers improved energy efficiency and scalability compared to traditional data center cooling systems. By utilizing modular components and built-in airflow connection components, the system can adapt to changing needs more effectively, resulting in better energy usage and scalability.

What are the potential cost implications of implementing this modular data center system compared to traditional data center setups?

The implementation of the modular data center system may have higher upfront costs due to the need for specialized components and infrastructure. However, in the long run, the system's energy efficiency and scalability can lead to cost savings through reduced energy consumption and easier expansion capabilities.


Original Abstract Submitted

A modular data center includes: a modular information technology component (MITC), in which the MITC comprises a cooling distribution unit (CDU), a floor, a bottom cooling distribution unit mounting component (CDUMC), a modular over-rack component (MORC), and a top CDUMC, in which the floor comprises a floor track apparatus (FTA), in which the bottom CDUMC affixes the CDU to the FTA, in which the top CDUMC affixes the CDU to the MORC, in which the top CDUMC provides air containment with an internal environment of the MITC; and a modular environmental control component (MECC), in which the MECC comprises a plurality of environmental control components (ECCs) and built-in airflow connection components, in which the built-in airflow connection components remove and supply air to the MITC.