17969773. SELF-ALIGNED ZERO TRACK SKIP simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

SELF-ALIGNED ZERO TRACK SKIP

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Reinaldo Vega of Mahopac NY (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Takashi Ando of Eastchester NY (US)

David Wolpert of Poughkeepsie NY (US)

Albert M. Chu of Nashua NH (US)

Albert M. Young of Fishkill NY (US)

SELF-ALIGNED ZERO TRACK SKIP - A simplified explanation of the abstract

This abstract first appeared for US patent application 17969773 titled 'SELF-ALIGNED ZERO TRACK SKIP

Simplified Explanation

The semiconductor structure described in the abstract includes two levels of interconnect wiring, with the first level separated into two segments defining line segments. The distalmost ends of these line segments are positioned close together, with a spacing less than or equal to the spacing of the second level interconnect wiring.

• The semiconductor structure includes a first level of interconnect wiring separated into two segments.
• The first interconnect wiring segment defines a first line segment, while the second interconnect wiring segment defines a second line segment.
• A second level of interconnect wiring is positioned orthogonally to the first level of interconnect wiring.
• The distalmost ends of the first and second line segments are separated by a spacing less than or equal to the spacing of the second level interconnect wiring, defining a zero track skip.

Potential Applications

This technology could be applied in the manufacturing of advanced semiconductor devices, such as microprocessors and memory chips.

Problems Solved

This innovation helps in reducing signal interference and improving the overall performance and reliability of semiconductor devices.

Benefits

The close proximity of the line segments allows for efficient signal transmission and compact design of semiconductor structures.

Potential Commercial Applications

The technology could be utilized in the production of high-performance electronic devices for various industries, including telecommunications and computing.

Possible Prior Art

One possible prior art could be the use of multi-level interconnect wiring in semiconductor structures to improve signal routing efficiency.

Unanswered Questions

How does this technology impact power consumption in semiconductor devices?

The article does not address the potential effects of this technology on power efficiency in semiconductor devices.

Are there any limitations to the size or complexity of semiconductor structures that can benefit from this innovation?

The article does not specify any restrictions or limitations on the applicability of this technology to different types of semiconductor structures.

Original Abstract Submitted

A semiconductor structure is presented including a first level of interconnect wiring separated into a first interconnect wiring segment and a second interconnect wiring segment, the first interconnect wiring segment defining a first line segment and the second interconnect wiring segment defining a second line segment and a second level interconnect wiring positioned orthogonally to the first level of interconnect wiring. A distalmost end of the first line segment and a distalmost end of the second line segment are separated by a spacing less than or equal to a spacing of the second level interconnect wiring defining a zero track skip.