17968552. Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes simplified abstract (Microfabrica Inc.)
Contents
- 1 Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
Organization Name
Inventor(s)
Arun S. Veeramani of Vista CA (US)
Ming Ting Wu of San Jose CA (US)
Dennis R. Smalley of Newhall CA (US)
Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes - A simplified explanation of the abstract
This abstract first appeared for US patent application 17968552 titled 'Probes with Planar Unbiased Spring Elements for Electronic Component Contact, Methods for Making Such Probes, and Methods for Using Such Probes
Simplified Explanation
The patent application describes probes for contacting electronic components that include compliant modules stacked in a serial configuration, supported by a sheath, exoskeleton, or endoskeleton allowing for linear longitudinal compression of probe ends. The compliant elements within the modules include planar springs, which may transition into multiple thinner spring elements along their lengths.
- Compliant modules stacked in a serial configuration
- Supported by a sheath, exoskeleton, or endoskeleton
- Linear longitudinal compression of probe ends
- Compliant elements include planar springs
- Planar springs may transition into multiple thinner spring elements
Potential Applications
The technology could be applied in the development of high-density electronic testing equipment, medical devices, or robotics.
Problems Solved
The innovation solves the problem of efficiently contacting electronic components in a compact and precise manner.
Benefits
The benefits of this technology include improved accuracy, increased efficiency, and the ability to work in tight spaces.
Potential Commercial Applications
The technology could be utilized in the manufacturing of electronic testing equipment, medical devices, or industrial automation systems.
Possible Prior Art
One possible prior art could be the use of compliant modules in electronic testing equipment, but the specific configuration and features described in the patent application may be novel.
Unanswered Questions
How does this technology compare to traditional probing methods in terms of cost and efficiency?
The article does not provide a direct comparison between this technology and traditional probing methods in terms of cost and efficiency. Further research or testing would be needed to determine the advantages and disadvantages in these areas.
What materials are used in the construction of the compliant modules and how does this impact their performance?
The article does not specify the materials used in the construction of the compliant modules or how they may impact performance. Understanding the material properties and their effects on the technology's functionality could be crucial for its practical application.
Original Abstract Submitted
Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner spring elements along their lengths. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
