17966021. MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING simplified abstract (Intel Corporation)
Contents
- 1 MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING
Organization Name
Inventor(s)
Yosef Kornbluth of Phoenix AZ (US)
Whitney Bryks of Tempe AZ (US)
Ravindranadh Tagore Eluri of Tempe AZ (US)
MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING - A simplified explanation of the abstract
This abstract first appeared for US patent application 17966021 titled 'MAGNET-DRIVEN CHEMICAL-MECHANICAL POLISHING
Simplified Explanation
The patent application describes a system for enhanced plate polishing by placing a liquid between a plate and a wafer, utilizing a controller to vary current flowing through coils, and applying pressure on the plate to press against the liquid and the wafer.
- Liquid is placed between a plate and a wafer
- Controller varies current flowing through coils
- Pressure is applied on the plate to press against the liquid and the wafer
Potential Applications
The technology could be applied in the semiconductor industry for polishing wafers and plates.
Problems Solved
This technology solves the problem of achieving enhanced plate polishing by effectively pressing the plate against the wafer with the help of a liquid medium.
Benefits
The benefits of this technology include improved polishing efficiency, better surface quality, and increased productivity in the semiconductor manufacturing process.
Potential Commercial Applications
"Enhanced Plate Polishing Technology for Semiconductor Manufacturing"
Possible Prior Art
There may be prior art related to plate polishing devices in the semiconductor industry, but specific examples are not provided in the abstract.
Unanswered Questions
How does the controller precisely control the current flowing through the coils?
The patent application does not provide details on the specific mechanism by which the controller varies the current through the coils to achieve the desired polishing effect.
What materials are suitable for the plate and wafer in this polishing process?
The abstract does not mention the specific materials that are compatible with this enhanced plate polishing system, leaving room for further exploration and clarification.
Original Abstract Submitted
This disclosure describes systems, methods, and devices related to enhanced plate polishing. A device may place a liquid between a plate and a wafer. The device may utilize a controller to vary a current flowing through an array of coils. The device may apply pressure on the plate to press against the liquid and the wafer.
