View source for 17961214. LOAD LOCK CHAMBERS AND RELATED METHODS AND STRUCTURES FOR BATCH COOLING OR HEATING simplified abstract (Applied Materials, Inc.)

=LOAD LOCK CHAMBERS AND RELATED METHODS AND STRUCTURES FOR BATCH COOLING OR HEATING=


==Organization Name==

[[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]


[[Category:Applied Materials, Inc.]]

==Inventor(s)==

[[:Category:Vishwas Kumar Pandey of Madhya Pradesh (IN)|Vishwas Kumar Pandey of Madhya Pradesh (IN)]][[Category:Vishwas Kumar Pandey of Madhya Pradesh (IN)]]

[[:Category:Ala Moradian of Sunnyvale CA (US)|Ala Moradian of Sunnyvale CA (US)]][[Category:Ala Moradian of Sunnyvale CA (US)]]

==LOAD LOCK CHAMBERS AND RELATED METHODS AND STRUCTURES FOR BATCH COOLING OR HEATING - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17961214 titled 'LOAD LOCK CHAMBERS AND RELATED METHODS AND STRUCTURES FOR BATCH COOLING OR HEATING

==Simplified Explanation==

The present disclosure relates to chambers and related methods and structures for batch cooling or heating. In one implementation, a chamber applicable for use in semiconductor manufacturing includes a base, a lid, and one or more sidewalls between the base and the lid. The base, the lid, and the one or more sidewalls at least partially define an internal volume. The chamber includes a cassette disposed in the internal volume. The cassette includes a first outer plate, a second outer plate spaced from the first outer plate, and a plurality of levels between the first outer plate and the second outer plate. The plurality of levels include a plurality of substrate supports spaced from each other between the first outer plate and the second outer plate. The chamber includes one or more baffles disposed outwardly of the cassette.

* Chamber design for batch cooling or heating
* Cassette system with multiple levels for substrate support
* Baffles for improved temperature control

== Potential Applications ==
The technology described in this patent application could be applied in various industries such as semiconductor manufacturing, pharmaceuticals, and food processing where batch cooling or heating is required.

== Problems Solved ==
This technology solves the problem of efficiently cooling or heating multiple substrates simultaneously in a controlled environment, which is crucial for certain manufacturing processes.

== Benefits ==
- Increased efficiency in batch cooling or heating processes
- Improved temperature control for better product quality
- Space-saving design with multiple levels for substrate support

== Potential Commercial Applications ==
"Batch Cooling Chamber with Cassette System: Applications and Benefits"

== Possible Prior Art ==
There may be prior art related to batch cooling or heating chambers with cassette systems, but further research is needed to identify specific examples.

== Unanswered Questions ==
1. What specific materials are used in the construction of the chamber and cassette system?
2. Are there any limitations to the size or weight of substrates that can be accommodated in this chamber design?


==Original Abstract Submitted==

The present disclosure relates to chambers and related methods and structures for batch cooling or heating. In one implementation, a chamber applicable for use in semiconductor manufacturing includes a base, a lid, and one or more sidewalls between the base and the lid. The base, the lid, and the one or more sidewalls at least partially define an internal volume. The chamber includes a cassette disposed in the internal volume. The cassette includes a first outer plate, a second outer plate spaced from the first outer plate, and a plurality of levels between the first outer plate and the second outer plate. The plurality of levels include a plurality of substrate supports spaced from each other between the first outer plate and the second outer plate. The chamber includes one or more baffles disposed outwardly of the cassette.



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