17955785. DOG BONE EXHAUST SLIT TUNNEL FOR PROCESSING CHAMBERS simplified abstract (Applied Materials, Inc.)
Contents
- 1 DOG BONE EXHAUST SLIT TUNNEL FOR PROCESSING CHAMBERS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 DOG BONE EXHAUST SLIT TUNNEL FOR PROCESSING CHAMBERS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
DOG BONE EXHAUST SLIT TUNNEL FOR PROCESSING CHAMBERS
Organization Name
Inventor(s)
Vishwas Kumar Pandey of Madhya Pradesh (IN)
Ala Moradian of Sunnyvale CA (US)
Zhepeng Cong of San Jose CA (US)
DOG BONE EXHAUST SLIT TUNNEL FOR PROCESSING CHAMBERS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17955785 titled 'DOG BONE EXHAUST SLIT TUNNEL FOR PROCESSING CHAMBERS
Simplified Explanation
The patent application describes a processing chamber with a unique exhaust slit assembly design that allows for efficient gas flow and thermal processing.
- The chamber body includes a first side, a second side, a window assembly, and a base, defining a thermal processing region.
- A flow assembly introduces processing gas into the thermal processing region.
- An exhaust slit assembly, adjacent to the second side, has an opening with a larger outer height compared to the center height, allowing for improved gas exhaust.
- The design of the exhaust slit assembly enhances gas flow and thermal processing efficiency in the chamber.
Potential Applications
This technology could be applied in semiconductor manufacturing processes, such as chemical vapor deposition and etching, where precise control of gas flow and thermal processing is crucial.
Problems Solved
1. Improved gas flow: The unique exhaust slit assembly design helps to efficiently exhaust processing gases from the chamber, enhancing overall performance. 2. Enhanced thermal processing: The chamber design allows for better control and distribution of heat within the processing region, leading to more consistent and reliable results.
Benefits
1. Increased efficiency: The optimized gas flow and thermal processing capabilities result in higher productivity and quality in semiconductor manufacturing. 2. Improved control: The chamber design offers better control over processing parameters, leading to more precise and consistent outcomes.
Potential Commercial Applications
"Enhanced Gas Flow and Thermal Processing Chamber Design for Semiconductor Manufacturing"
Possible Prior Art
There may be prior art related to chamber designs for thermal processing in semiconductor manufacturing, but the specific exhaust slit assembly design described in this patent application appears to be a novel innovation.
Unanswered Questions
How does this technology compare to existing exhaust slit assembly designs in terms of gas flow efficiency and thermal processing control?
The article does not provide a direct comparison with existing exhaust slit assembly designs, so it is unclear how this technology stacks up against current solutions. Further research or testing would be needed to evaluate its performance in relation to existing designs.
What specific semiconductor manufacturing processes can benefit the most from this chamber design?
While the article mentions general applications in semiconductor manufacturing, it does not specify which processes would see the greatest improvements from this technology. Understanding the specific processes that can benefit the most would help in targeting potential customers and markets more effectively.
Original Abstract Submitted
A processing chamber is disclosed and includes a chamber body. The chamber body has a first side, a second side opposite the first side, a window assembly, and a base. The first and second side, the window assembly and the base define a thermal processing region. A flow assembly is disposed adjacent the first side and configured to introduce a processing gas into the thermal processing region. An exhaust slit assembly is disposed adjacent the second side. The exhaust slit assembly has an opening exposed to the thermal processing region. The opening having a center and an outer edge of the opening. The center of the opening and edge of the opening vertically defined between the window assembly and the base. Wherein an outer height at the edge of the opening is at least 30% larger in a vertical direction than a center height at the center of the opening.
