17954509. METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Hyekyoung Lee of Suwon-si (KR)
Kyungdeuk Min of Suwon-si (KR)
Donggil Kang of Yongin-si (KR)
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17954509 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Simplified Explanation
The patent application describes a method of manufacturing a semiconductor device using a mask and a light soldering process. Here are the key points:
- The method involves arranging a mask on a support, which has a first area and a second area.
- A substrate is placed on the mask, which has a mounting area and a non-mounting area.
- Solder paste is applied to the mounting area of the substrate.
- Electronic devices are then arranged on the mounting area.
- A light soldering process is performed by emitting light on the substrate from a light source above it.
- The first area of the mask is positioned under the non-mounting area, and the second area of the mask is positioned under the mounting area.
Potential applications of this technology:
- Manufacturing of semiconductor devices, such as integrated circuits, microprocessors, and memory chips.
- Production of electronic components for various industries, including telecommunications, automotive, and consumer electronics.
Problems solved by this technology:
- Provides a simplified and efficient method for soldering electronic devices onto a substrate.
- Ensures precise alignment of the mask and substrate, improving the accuracy of the soldering process.
- Reduces the risk of damage to the electronic devices during soldering.
Benefits of this technology:
- Faster and more cost-effective manufacturing process compared to traditional soldering methods.
- Improved accuracy and reliability of soldering, leading to higher quality semiconductor devices.
- Reduced risk of damage to electronic devices, resulting in lower production costs and waste.
Original Abstract Submitted
A method of manufacturing a semiconductor device includes arranging a mask on a support. The mask includes a first area and a second area. A substrate is arranged on the mask. The substrate has a mounting area and a non-mounting area. A solder paste is applied on the mounting area of the substrate. After applying the solder paste, at least one electronic device is arranged on the mounting area. A light soldering process is performed by emitting light on the substrate from a light source above the substrate. The first area of the mask is positioned under the non-mounting area and the second area of the mask is positioned under the mounting area.
