17952637. SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS FOR THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

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SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS FOR THE SAME

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Kyunghwan Lee of Suwon-si (KR)

Yongseok Kim of Suwon-si (KR)

Hyuncheol Kim of Seoul (KR)

Jongman Park of Hwaseong-si (KR)

Dongsoo Woo of Seoul (KR)

Minjun Lee of Seoul (KR)

SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS FOR THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17952637 titled 'SEMICONDUCTOR DEVICES AND MANUFACTURING METHODS FOR THE SAME

Simplified Explanation

The patent application describes a semiconductor device with multiple gate electrodes on a substrate, each having vertical extension sidewalls. It includes a channel layer on the first vertical extension sidewall of each gate electrode, along with a ferroelectric layer and a gate insulating layer. An insulating layer is present on the second vertical extension sidewall of each gate electrode. Additionally, there are multiple bit lines connected to the channel layer and extending in a different horizontal direction.

  • The semiconductor device has gate electrodes with vertical extension sidewalls, allowing for efficient use of space on the substrate.
  • The channel layer on the first vertical extension sidewall of each gate electrode helps in controlling the flow of current.
  • The presence of a ferroelectric layer and a gate insulating layer enhances the performance of the device.
  • The insulating layer on the second vertical extension sidewall of each gate electrode provides isolation and prevents interference.
  • The multiple bit lines connected to the channel layer enable data transfer in a different horizontal direction.

Potential Applications

This technology can be applied in various fields, including:

  • Integrated circuits
  • Memory devices
  • Microprocessors
  • Digital logic circuits

Problems Solved

The semiconductor device described in the patent application addresses the following problems:

  • Efficient utilization of space on the substrate
  • Enhanced control of current flow
  • Isolation and prevention of interference
  • Efficient data transfer in different directions

Benefits

The benefits of this technology include:

  • Improved performance and functionality of semiconductor devices
  • Increased data transfer efficiency
  • Space-saving design on the substrate
  • Enhanced control and isolation of current flow


Original Abstract Submitted

A semiconductor device includes a plurality of gate electrodes extending on a substrate in a first horizontal direction and each including first and second vertical extension sidewalls that are opposite to each other, a channel arranged on the first vertical extension sidewall of each gate electrode and including a vertical extension portion, a ferroelectric layer and a gate insulating layer that are sequentially located between the channel layer and the first vertical extension sidewall of each gate electrode, an insulating layer on the second vertical extension sidewall of each gate electrode, and a plurality of bit lines electrically connected to the channel layer and extending in a second horizontal direction that is different from the first horizontal direction.