17936845. ANTI-FUSE AND FUSE STRUCTURES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS simplified abstract (International Business Machines Corporation)
Contents
- 1 ANTI-FUSE AND FUSE STRUCTURES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 ANTI-FUSE AND FUSE STRUCTURES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
ANTI-FUSE AND FUSE STRUCTURES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS
Organization Name
International Business Machines Corporation
Inventor(s)
Vivekananda P. Adiga of Ossining NY (US)
Russell A. Budd of North Salem NY (US)
Charles Thomas Rettner of San Jose CA (US)
Stephen M. Gates of New York NY (US)
ANTI-FUSE AND FUSE STRUCTURES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17936845 titled 'ANTI-FUSE AND FUSE STRUCTURES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS
Simplified Explanation
The abstract describes a method of constructing a superconducting switch by depositing a sacrificial layer on a substrate, patterning the sacrificial layer and a superconducting metal layer, and etching the sacrificial layer to release the metal line from the substrate.
- Deposit a thin sacrificial layer on top of a substrate
- Pattern the sacrificial layer to leave it only at a first portion of the substrate
- Pattern a superconducting metal layer on top of the substrate and sacrificial layer to form a superconducting metal line
- Etch the sacrificial layer from under the superconducting metal line to release it from the substrate
Potential Applications
The technology could be used in superconducting electronics, quantum computing, and high-speed computing applications.
Problems Solved
This method provides a way to create superconducting switches with precise patterning and control, allowing for improved performance and functionality in electronic devices.
Benefits
- Enhanced performance in superconducting electronics - Increased control and precision in device fabrication - Potential for faster and more efficient computing systems
Potential Commercial Applications
"Superconducting Switch Construction Method for Advanced Electronics"
Possible Prior Art
There may be prior art related to the fabrication of superconducting devices using sacrificial layers, but specific examples are not provided in this abstract.
Unanswered Questions
How does the thickness of the sacrificial layer impact the performance of the superconducting switch?
The abstract does not mention how the thickness of the sacrificial layer may affect the functionality or properties of the superconducting switch.
Are there any limitations to the size or scale of devices that can be fabricated using this method?
It is not clear from the abstract whether there are any limitations to the size or scale of devices that can be produced using this superconducting switch construction method.
Original Abstract Submitted
A method of constructing a superconducting switch includes depositing a thin sacrificial layer on top of a substrate. The sacrificial layer is patterned to remove portions of the sacrificial layer except at a first portion of the substrate. A superconducting metal layer is patterned on top of the substrate and on top of the sacrificial layer. The superconducting metal layer is patterned to form a superconducting metal line over the sacrificial layer. The patterned sacrificial layer is etched from under the superconducting metal line to release the metal line from the substrate.
