View source for 17932788. ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION simplified abstract (QUALCOMM Incorporated)

=ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION=


==Organization Name==

[[:Category:QUALCOMM Incorporated|QUALCOMM Incorporated]]


[[Category:QUALCOMM Incorporated]]

==Inventor(s)==

[[:Category:Ranadeep Dutta of Del Mar CA (US)|Ranadeep Dutta of Del Mar CA (US)]][[Category:Ranadeep Dutta of Del Mar CA (US)]]

[[:Category:Jonghae Kim of San Diego CA (US)|Jonghae Kim of San Diego CA (US)]][[Category:Jonghae Kim of San Diego CA (US)]]

[[:Category:Je-Hsiung Lan of San Diego CA (US)|Je-Hsiung Lan of San Diego CA (US)]][[Category:Je-Hsiung Lan of San Diego CA (US)]]

==ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17932788 titled 'ON-CHIP HYBRID ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING WITH THERMAL MITIGATION

==Simplified Explanation==

The abstract describes techniques for on-chip electromagnetic interference (EMI) shielding in integrated circuits. Here is a simplified explanation of the patent application:

* An integrated circuit includes a noise-sensitive device with a first metallization layer on one side, containing conductive routing layers forming an on-chip EMI shield.
* A second metallization layer is on the opposite side of the noise-sensitive device, also containing conductive routing layers forming an on-chip EMI shield.

### Potential Applications
- Electronic devices
- Communication systems
- Automotive electronics

### Problems Solved
- Minimizing electromagnetic interference
- Protecting noise-sensitive devices
- Improving overall performance of integrated circuits

### Benefits
- Enhanced reliability of electronic devices
- Improved signal integrity
- Reduced interference in communication systems

### Potential Commercial Applications
#### Optimizing EMI Shielding in Integrated Circuits

### Possible Prior Art
There are existing techniques for EMI shielding in integrated circuits, such as using external shielding materials or coatings to reduce interference. However, the specific on-chip EMI shielding configuration described in this patent application may be a novel approach to address EMI issues within the integrated circuit itself.

#### Unanswered Questions
#### How does the on-chip EMI shielding impact the overall size and layout of the integrated circuit?
The abstract does not provide details on the impact of the on-chip EMI shielding on the physical dimensions and layout of the integrated circuit.

#### Are there any limitations or trade-offs associated with implementing on-chip EMI shielding?
The abstract does not mention any potential limitations or trade-offs that may arise from the implementation of on-chip EMI shielding in integrated circuits.


==Original Abstract Submitted==

Disclosed are techniques for on-chip electromagnetic interference (EMI) shielding. In an aspect, an integrated circuit includes a noise-sensitive device, a first metallization layer disposed on a first side of the noise-sensitive device, wherein the first metallization layer includes a plurality of conductive routing layers, and wherein conductive routing within the plurality of conductive routing layers is configured as a first side of an on-chip electromagnetic interference (EMI) shield around the first side of the noise-sensitive device, and a second metallization layer disposed on a second side of the noise-sensitive device opposite the first side of the noise-sensitive device, wherein the second metallization layer includes one or more conductive routing layers, and wherein conductive routing within the one or more conductive routing layers is configured as a second side of the on-chip EMI shield around the second side of the noise-sensitive device.



[[Category:H01L23/552]]
[[Category:H01L21/48]]
[[Category:H01L23/00]]
[[Category:H01L23/373]]
[[Category:H01L23/498]]
[[Category:H01L23/528]]
[[Category:H01L23/66]]
[[Category:H01Q1/02]]
[[Category:H01Q1/22]]
[[Category:H01Q3/36]]
[[Category:H01Q9/04]]
[[Category:H01Q21/06]]