17889035. WAFER BAKING APPARATUS simplified abstract (Samsung Electronics Co., Ltd.)
Contents
WAFER BAKING APPARATUS
Organization Name
Inventor(s)
Byeongsang Kim of Hwaseong-si (KR)
Sungkun Hwang of Suwon-si (KR)
WAFER BAKING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 17889035 titled 'WAFER BAKING APPARATUS
Simplified Explanation
The abstract describes a wafer baking apparatus that includes a chamber with a processing space and a wafer heater. The wafer heater consists of a first heating plate, a heating resistance pattern on the lower surface of the first heating plate, a second heating plate on top of the first heating plate, and a heat dispersion layer between the two heating plates.
- The wafer heater is designed to support a wafer during the baking process.
- The first heating plate contains a heating resistance pattern that helps in heating the wafer.
- The second heating plate is placed on top of the first heating plate to provide additional heating.
- The heat dispersion layer, located between the two heating plates, has a lower thermal conductivity than the materials of the heating plates.
Potential applications of this technology:
- Semiconductor manufacturing: The wafer baking apparatus can be used in the production of semiconductors, where precise heating of wafers is crucial.
- Electronics manufacturing: This technology can be applied in the manufacturing of various electronic devices that require precise and controlled heating processes.
Problems solved by this technology:
- Efficient heating: The design of the wafer heater ensures that heat is evenly distributed across the wafer, resulting in more efficient baking processes.
- Temperature control: The use of the heat dispersion layer helps in maintaining a consistent temperature during the baking process.
Benefits of this technology:
- Improved quality: The even distribution of heat across the wafer helps in achieving better quality products.
- Energy efficiency: The efficient heating process reduces energy consumption and improves overall energy efficiency.
- Enhanced control: The design allows for better temperature control, leading to more precise and accurate baking processes.
Original Abstract Submitted
A wafer baking apparatus includes a chamber including a processing space, and a wafer heater disposed in the processing space and configured to support a wafer. The wafer heater includes a first heating plate, a heating resistance pattern disposed on a lower surface of the first heating plate, a second heating plate disposed on the first heating plate, and a heat dispersion layer interposed between the first and second heating plates and having thermal conductivity lower than a thermal conductivity of materials of the first and second heating plates.
