17883250. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
YOUNG-JA Kim of Cheonan-si (KR)
HYUNGGIL Baek of Suwon-si (KR)
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17883250 titled 'METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
Simplified Explanation
The patent application describes a method of manufacturing a semiconductor package by estimating errors in the solder ball attaching process and determining the specifications of a ball tool and the method of the solder ball attaching process based on these estimated errors. The method includes manufacturing the ball tool according to the determined specifications and performing the solder ball attaching process based on the determined method.
- The method estimates errors in the solder ball attaching process.
- The specifications of the ball tool and the method of the solder ball attaching process are determined based on the estimated errors.
- The ball tool is manufactured according to the determined specifications.
- The solder ball attaching process is performed based on the determined method.
Potential Applications
- Semiconductor manufacturing industry
- Electronics manufacturing industry
Problems Solved
- Reduces errors in the solder ball attaching process
- Improves the accuracy and efficiency of the manufacturing process
Benefits
- Improved quality and reliability of semiconductor packages
- Cost savings through reduced errors and improved efficiency
Original Abstract Submitted
A method of manufacturing a semiconductor package includes estimating an error in a solder ball attaching process, determining a specification of a ball tool and a method of the solder ball attaching process, based on the estimated error, manufacturing the ball tool according to the determined specification thereof, and performing the solder ball attaching process based on the method of the solder ball attaching process. The determining of the specification of the ball tool and the method of the solder ball attaching process includes determining a number of a plurality of holders in the ball tool and a position and a width of each of the plurality of holders, determining a number of a plurality of working regions of a substrate and a position and a width of each of the plurality of working regions, and dividing a substrate into the plurality of working regions.
