17870581. CAMERA MODULE ON FLEXIBLE INTERCONNECT TAPE simplified abstract (Meta Platforms Technologies, LLC)
Contents
- 1 CAMERA MODULE ON FLEXIBLE INTERCONNECT TAPE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 CAMERA MODULE ON FLEXIBLE INTERCONNECT TAPE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
CAMERA MODULE ON FLEXIBLE INTERCONNECT TAPE
Organization Name
Meta Platforms Technologies, LLC
Inventor(s)
Samuel Tam of Daly City CA (US)
CAMERA MODULE ON FLEXIBLE INTERCONNECT TAPE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17870581 titled 'CAMERA MODULE ON FLEXIBLE INTERCONNECT TAPE
Simplified Explanation
The camera module described in the patent application includes an image sensor die, high-density interconnect (HDI) tape, and passive electronic components. The image sensor die has a pixel array on one side and bonding pads on the other side. The HDI tape is a flexible substrate with traces that connect the image sensor die to the passive electronic components, providing rigidity to the camera module.
- Image sensor die with pixel array and bonding pads
- HDI tape with traces connecting image sensor die to passive electronic components
- Passive electronic components providing rigidity to the camera module
Potential Applications
The technology described in this patent application could be used in various applications such as:
- Mobile phone cameras
- Surveillance cameras
- Automotive cameras
Problems Solved
This technology solves the following problems:
- Providing rigidity to camera modules
- Efficiently connecting image sensor die to passive electronic components
Benefits
The benefits of this technology include:
- Improved durability of camera modules
- Compact design for smaller devices
- Enhanced image quality
Potential Commercial Applications
The technology could be commercially applied in:
- Smartphone manufacturing
- Security camera production
- Automotive industry for advanced driver-assistance systems
Possible Prior Art
One possible prior art for this technology could be the use of flexible substrates in electronic devices to improve connectivity and flexibility.
Unanswered Questions
How does this technology compare to existing camera module designs in terms of size and performance?
This article does not provide a direct comparison with existing camera module designs in terms of size and performance. Further research and testing would be needed to make a comprehensive comparison.
What are the potential challenges in implementing this technology in mass production?
The article does not address the potential challenges in implementing this technology in mass production. Factors such as cost, scalability, and compatibility with existing manufacturing processes could pose challenges that need to be explored further.
Original Abstract Submitted
A camera module includes an image sensor die, high-density interconnect (HDI) tape, and a number of passive electronic components. The image sensor die has a first side and a second side. The first side includes a pixel array, and the second side includes a number of bonding pads. The HDI tape is a flexible substrate coupled to the image sensor. The HDI tape includes a number of traces positioned between a first side and a second side. The first side of the HDI tape is coupled to the second side of the image sensor die. The passive electronic components are coupled to the second side of the HDI tape and provide rigidity to the camera module.
