17869109. ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE
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ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17869109 titled 'ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION STRUCTURE
Simplified Explanation
The abstract describes an electronic device with a heat dissipation structure that includes a heat dissipation layer and a protective layer. The protective layer has a lower thermal conductivity than the heat dissipation layer and covers at least a portion of it.
- The electronic device includes a housing, a display, and a support for the display.
- The support has an opening and a side wall surrounding the opening.
- The heat dissipation structure is positioned in the opening and bonded to the side wall.
- The heat dissipation structure includes a heat dissipation layer and a protective layer.
- The heat dissipation layer has a higher thermal conductivity than the protective layer.
- The protective layer covers at least a portion of the heat dissipation layer.
Potential applications of this technology:
- Electronic devices with improved heat dissipation capabilities.
- Mobile phones, tablets, laptops, or other devices that generate heat during operation.
- Devices with compact designs that require efficient heat management.
Problems solved by this technology:
- Overheating issues in electronic devices.
- Ensuring proper functioning and longevity of electronic components.
- Preventing damage caused by excessive heat.
Benefits of this technology:
- Improved heat dissipation efficiency.
- Enhanced performance and reliability of electronic devices.
- Protection against overheating-related issues.
- Compact and space-saving design options for electronic devices.
Original Abstract Submitted
According to various embodiments of the disclosure, an electronic device may include: a housing, a display accommodated inside the housing, a support supporting the display and including a opening and a side wall surrounding the opening, and a heat dissipation structure at least a portion of which is positioned in the opening and bonded to the side wall, wherein the heat dissipation structure may include a heat dissipation layer having a first thermal conductivity and a protective layer having a second thermal conductivity, is the second thermal conductivity being lower than the first thermal conductivity, the protective layer covering at least a portion of the heat dissipation layer.
