17862482. FAN-OUT SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
FAN-OUT SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
FAN-OUT SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 17862482 titled 'FAN-OUT SEMICONDUCTOR PACKAGE
Simplified Explanation
The abstract describes a fan-out semiconductor package that includes a package body with a fan-in area, a fan-out area, and a body interconnect structure. It also includes a fan-in chip structure located in a through-hole, a redistribution structure on the bottom surface of the package body and fan-in chip structure, and an interconnect via on the top surface of the package body.
- The fan-out semiconductor package has a package body with a fan-in area and a fan-out area.
- The fan-in chip structure is located in a through-hole and includes a first chip, a capacitor chip, and a second chip.
- The redistribution structure is on the bottom surface of the package body and fan-in chip structure, and it extends to the fan-out area.
- The interconnect via is on the top surface of the package body and is connected to the redistribution element in the fan-out area.
Potential Applications
- This fan-out semiconductor package can be used in various electronic devices, such as smartphones, tablets, and computers.
- It can be applied in high-performance computing systems, where compact and efficient packaging is crucial.
Problems Solved
- The fan-out semiconductor package solves the problem of limited space in electronic devices by providing a compact package design.
- It solves the issue of interconnectivity by using a redistribution structure and interconnect via to connect different components.
Benefits
- The fan-out semiconductor package allows for higher integration and miniaturization of electronic devices.
- It enables improved electrical performance and signal transmission due to the efficient interconnect structure.
- The package design offers better thermal management and reliability.
Original Abstract Submitted
A fan-out semiconductor package includes: a package body including a fan-in area corresponding to a through-hole located therein, a fan-out area surrounding the fan-in area, and a body interconnect structure arranged in the package body corresponding to the fan-out area; a fan-in chip structure located in the through-hole, the fan-in chip structure comprising a first chip, a capacitor chip arranged to be apart from the first chip, and a second chip disposed on both the first chip and the capacitor chip; a redistribution structure arranged on a bottom surface of the package body and a bottom surface of the fan-in chip structure and including a redistribution element extending to the fan-out area; and an interconnect via arranged on a top surface of the package body and electrically connected to the redistribution element in the fan-out area.
