17849679. THERMAL MANAGEMENT OF COMPUTER HARDWARE MODULES simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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THERMAL MANAGEMENT OF COMPUTER HARDWARE MODULES

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Yuanchen Hu of Peekskill NY (US)

Sushumna Iruvanti of Wappingers Falls NY (US)

Philipp K Buchling Rego of Wappingers Falls NY (US)

THERMAL MANAGEMENT OF COMPUTER HARDWARE MODULES - A simplified explanation of the abstract

This abstract first appeared for US patent application 17849679 titled 'THERMAL MANAGEMENT OF COMPUTER HARDWARE MODULES

Simplified Explanation

The patent application describes a structure for managing the heat generated by pluggable hardware modules, such as optical transceivers. The structure includes a socket assembly that can receive the hardware module and has an integrated fluid reservoir containing a thermal interface material (TIM). When the hardware module is plugged into the socket assembly, a gap is created. The structure also includes dispensing ports that automatically distribute the TIM from the reservoir into the gap.

  • The structure includes a socket assembly that can receive a hardware module.
  • The socket assembly has an integrated fluid reservoir containing a thermal interface material (TIM).
  • When the hardware module is plugged into the socket assembly, a gap is created.
  • Dispensing ports are included in the structure to automatically distribute the TIM from the reservoir into the gap.

Potential applications of this technology:

  • Thermal management of pluggable hardware modules, such as optical transceivers.
  • Cooling of electronic components in various devices.

Problems solved by this technology:

  • Heat generated by pluggable hardware modules can cause performance issues and damage to the components.
  • Traditional cooling methods may not be efficient or effective for pluggable hardware modules.

Benefits of this technology:

  • Improved thermal management of pluggable hardware modules.
  • Enhanced performance and reliability of electronic components.
  • Simplified cooling process for pluggable hardware modules.


Original Abstract Submitted

Aspects of the disclosure include a structure for thermal management of pluggable hardware modules, an optical transceiver, and a method of cooling a pluggable hardware module. One embodiment of the structure may comprise a socket assembly adapted to receive a hardware module. The socket assembly may comprise an integrated fluid reservoir containing a thermal interface material (TIM). The socket assembly may be further adapted to define a gap when the hardware module is plugged into the socket assembly. The structure may further comprise at least one dispensing port in fluid communication with the integrated fluid reservoir and the gap. The at least one dispensing port may be adapted to automatically distribute TIM from the integrated fluid reservoir into the gap when the hardware module is plugged into the socket assembly.

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