17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

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HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

Szu-Wei Lu of Hsinchu (TW)

Tsung-Fu Tsai of Changhua (TW)

Chi-Hsiang Chen of Taipei (TW)

HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 17837312 titled 'HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Simplified Explanation

The patent application describes a device that includes a package substrate, an interposer, a die, a ring, a molding compound, and thermal-conductive layers. Here are the key points:

  • The device consists of a package substrate, which serves as a base for the other components.
  • An interposer is bonded to one side of the package substrate.
  • A die is bonded to the other side of the interposer.
  • A ring is present on the package substrate, surrounding the interposer and the die.
  • A molding compound is placed between the ring and the die, making physical contact with the ring.
  • A plurality of thermal-conductive layers are placed over the molding compound and the die, with the molding compound acting as a barrier between the layers and the ring.

Potential applications of this technology:

  • This device can be used in electronic devices that require efficient thermal management, such as high-performance computers, servers, and power electronics.
  • It can also be utilized in automotive applications, where heat dissipation is crucial for the proper functioning of electronic components.

Problems solved by this technology:

  • The device addresses the issue of thermal management by providing a structure that allows for efficient heat transfer from the die to the thermal-conductive layers.
  • The presence of the molding compound between the thermal-conductive layers and the ring helps prevent any interference or heat loss.

Benefits of this technology:

  • The device offers improved thermal conductivity, allowing for better heat dissipation and preventing overheating of the die.
  • The use of the interposer and the molding compound helps reduce the thermal resistance between the die and the thermal-conductive layers, enhancing overall thermal performance.
  • The design of the device provides a compact and efficient solution for thermal management in electronic devices.


Original Abstract Submitted

A device includes a package substrate, an interposer having a first side bonded to the package substrate, a first die bonded to a second side of the interposer, the second side being opposite the first side, a ring on the package substrate, where the ring surrounds the first die and the interposer, a molding compound disposed between the ring and the first die, where the molding compound is in physical contact with the ring, and a plurality of thermal-conductive layers over and in physical contact with the molding compound and the first die, where the molding compound is disposed between the plurality of thermal-conductive layers and the ring.

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