17825508. BOARD HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 BOARD HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 BOARD HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Original Abstract Submitted
BOARD HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME
Organization Name
Inventor(s)
Bongchoon Park of Suwon-si (KR)
BOARD HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17825508 titled 'BOARD HAVING CONDUCTIVE LAYER FOR SHIELDING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE INCLUDING THE SAME
Simplified Explanation
The patent application describes an electronic device that includes a board, electronic components, an insulation member, and a conductive layer. The conductive layer is divided into three parts and is connected to the first and second conductive lines on the board. The device also includes at least one transmission line formed by the second conductive line and the third part of the conductive layer.
- The electronic device includes a board with conductive lines and a ground plane.
- It has at least one electronic component placed on the board.
- An insulation member covers the electronic component.
- A conductive layer is present, divided into three parts.
- The first part of the conductive layer is formed on the surface of the insulation member.
- The second part extends from the edge of the first part and is connected to the first conductive line on the board.
- The third part is spaced apart from the second part and is connected to the second conductive line on the board.
- The device includes at least one transmission line formed by the second conductive line and the third part of the conductive layer.
Potential Applications
- This technology can be applied in various electronic devices such as smartphones, tablets, and computers.
- It can be used in circuit boards and PCB designs to improve signal transmission and reduce interference.
Problems Solved
- The electronic device addresses the problem of signal transmission and interference in circuit boards.
- It provides a solution for connecting conductive lines and components in a compact and efficient manner.
Benefits
- The conductive layer and transmission line improve the overall performance and reliability of the electronic device.
- It allows for better signal integrity and reduced electromagnetic interference.
- The design simplifies the connection between conductive lines and components, making it easier to manufacture and assemble the device.
Original Abstract Submitted
An electronic device is provided. The electronic device includes a board including a first conductive line, a second conductive line, a ground plane, and a conductive via hole connecting the first conductive line and the ground plane, at least one electronic component disposed in the board, an insulation member covering the at least one electronic component, and a conductive layer, the conductive layer includes a first part formed on a surface of the insulation member, a second part extending from an edge of the first part and electrically connected to the first conductive line, and a third part spaced apart from the second part and electrically connected to the second conductive line, and the electronic device includes at least one transmission line constituted by the second conductive line and the third part of the conductive layer.
