17812966. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 17812966 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The abstract describes a semiconductor package that includes various components such as bump structures, bonding wires, an encapsulant, and a redistribution structure.
- The first bump structures are located below the second rear surface pads of the first group and are connected to the first front surface pads of the first group through bonding wires.
- Second bump structures are placed below the second rear surface pads of the second group.
- An encapsulant is used to encapsulate the second semiconductor chip and the first and second bump structures.
- The redistribution structure, located below the encapsulant, consists of an insulating layer, redistribution layers, and redistribution vias.
- The redistribution vias penetrate through the insulating layer and connect the redistribution layers to either the first bump structures or the second bump structures.
- Notably, a portion of the redistribution vias connected to the first bump structures is in contact with the stud portion.
Potential applications of this technology:
- Semiconductor packaging industry
- Electronics manufacturing
Problems solved by this technology:
- Efficient redistribution of electrical connections within a semiconductor package
- Improved reliability and performance of the package
Benefits of this technology:
- Enhanced electrical connectivity between different components
- Increased reliability and durability of the semiconductor package
- Improved overall performance and functionality of electronic devices.
Original Abstract Submitted
A semiconductor package includes first bump structures that include a stud portion disposed below the second rear surface pads of the first group, and a bonding wire portion that extends from the stud portion and is connected to the first front surface pads of the first group; second bump structures disposed below the second rear surface pads of the second group; an encapsulant that encapsulates the second semiconductor chip and the first and second bump structures; and a redistribution structure disposed below the encapsulant, and that includes an insulating layer, redistribution layers disposed below the insulating layer, and redistribution vias that penetrate through the insulating layer and connect the redistribution layers to the first bump structures or the second bump structures. At least a portion of the redistribution vias connected to the first bump structures is in contact with the stud portion.
