17746454. DICING BLADE INCLUDING DIAMOND PARTICLES simplified abstract (Samsung Electronics Co., Ltd.)
Contents
DICING BLADE INCLUDING DIAMOND PARTICLES
Organization Name
Inventor(s)
Youngja Kim of Cheonan-si (KR)
Hyunggil Baek of Suwon-si (KR)
Younhwan Shin of Hwaseong-si (KR)
DICING BLADE INCLUDING DIAMOND PARTICLES - A simplified explanation of the abstract
This abstract first appeared for US patent application 17746454 titled 'DICING BLADE INCLUDING DIAMOND PARTICLES
Simplified Explanation
The abstract describes a dicing blade that consists of two blade portions. The first blade portion has a bonding layer with diamond particles and metal particles, while the second blade portion has a bonding layer with diamond particles of higher density.
- The dicing blade has a first blade portion and a second blade portion.
- The first blade portion has a bonding layer with diamond particles and metal particles.
- The second blade portion surrounds the first blade portion and has a bonding layer with diamond particles of higher density.
- The second density of diamond particles in the second blade portion is higher than the first density in the first blade portion.
Potential Applications:
- Semiconductor manufacturing: The dicing blade can be used for cutting and dicing semiconductor wafers into individual chips.
- Electronics manufacturing: The blade can be used for cutting electronic components, such as printed circuit boards, into desired shapes and sizes.
Problems Solved:
- Improved cutting efficiency: The higher density of diamond particles in the second blade portion enhances the cutting performance, allowing for faster and more precise cuts.
- Reduced wear and tear: The combination of diamond particles and metal particles in the first blade portion provides durability and resistance to wear, increasing the lifespan of the dicing blade.
Benefits:
- Higher cutting efficiency: The dicing blade enables faster and more accurate cutting, improving productivity in manufacturing processes.
- Longer lifespan: The use of diamond particles and metal particles in the blade construction enhances durability, reducing the need for frequent blade replacements.
- Versatility: The dicing blade can be used in various industries, including semiconductor and electronics manufacturing, providing a versatile cutting solution.
Original Abstract Submitted
A dicing blade includes: a first blade portion and a second blade portion at least partially surrounding the first blade portion, wherein the first blade portion includes: a first bonding layer; first diamond particles disposed in the first bonding layer and having a first density in the first bonding layer; and first metal particles disposed in the first bonding layer, and wherein the second blade portion includes: a second bonding layer at least partially surrounding the first bonding layer; and second diamond particles disposed in the second bonding layer and having a second density in the second bonding layer, wherein the second density is higher than the first density.
