17740494. APPARATUS FOR SUBSTRATE DICING AND METHOD THEROF simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)

APPARATUS FOR SUBSTRATE DICING AND METHOD THEROF

Organization Name

SAMSUNG ELECTRONICS CO., LTD.

Inventor(s)

Sung Ho Jang of Hwaseong-si (KR)

Min Hwan Seo of Hwaseong-si (KR)

Jang Hwi Lee of Hwaseong-si (KR)

Young Chul Kwon of Asan-si (KR)

Sang Woo Bae of Seoul (KR)

Akinori Okubo of Hwaseong-si (KR)

Jung Chul Lee of Hwaseong-si (KR)

Won Don Joo of Incheon (KR)

APPARATUS FOR SUBSTRATE DICING AND METHOD THEROF - A simplified explanation of the abstract

This abstract first appeared for US patent application 17740494 titled 'APPARATUS FOR SUBSTRATE DICING AND METHOD THEROF

Simplified Explanation

The patent application describes a method for dicing a substrate using a laser beam. Here are the key points:

• The method involves setting a target height for forming a first reforming region inside a target substrate.
• The target height is the distance from the upper surface of the target substrate to the first reforming region.
• A laser beam is irradiated to a sample substrate that consists of a first film and a second film in contact with the first film.
• A target condition is set based on the sample condition, which results in forming a condensing point of the laser beam on the upper surface of the first film.
• The target substrate is then irradiated with the laser beam according to the target condition to form the first reforming region inside it.
• The thickness of the second film is set as the target height.

Potential applications of this technology:

• Semiconductor manufacturing: This method can be used for dicing semiconductor substrates into smaller chips.
• Electronics manufacturing: It can be applied in the production of electronic components that require precise cutting and reforming of substrates.
• Optics industry: The method can be used for dicing and shaping optical substrates for various applications.

Problems solved by this technology:

• Precise dicing: The method allows for accurate and controlled formation of reforming regions inside the substrate, ensuring precise dicing.
• Efficient process: By using a laser beam, the dicing process can be performed quickly and with high precision, reducing the need for manual labor and increasing productivity.
• Minimized damage: The method minimizes the risk of damage to the substrate during dicing, resulting in higher yield and quality of the final products.

Benefits of this technology:

• Improved accuracy: The method enables precise control over the formation of reforming regions, leading to accurate dicing and shaping of substrates.
• Time and cost savings: By using a laser beam, the dicing process can be completed faster and with fewer resources compared to traditional methods.
• Enhanced product quality: The minimized risk of damage during dicing ensures higher yield and improved quality of the final products.

Original Abstract Submitted

A method for dicing a substrate includes setting a target height for forming a first reforming region inside a target substrate, the target height being a distance from an upper surface of the target substrate to the first reforming region; irradiating a laser beam to a first sample substrate including a first film and a second film being in contact with the first film, and setting a target condition on the basis of a sample condition that results in forming a condensing point of the laser beam on an upper surface of the first film being in contact with the second film; and irradiating the target substrate with the laser beam according to the target condition to form the first reforming region inside the target substrate, wherein a thickness of the second film is the target height.