17541946. SILICON HANDLER WITH LASER-RELEASE LAYERS simplified abstract (INTERNATIONAL BUSINESS MACHINES CORPORATION)

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SILICON HANDLER WITH LASER-RELEASE LAYERS

Organization Name

INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor(s)

Akihiro Horibe of Yokohama-shi (JP)

Qianwen Chen of Chappaqua NY (US)

RISA Miyazawa of Isehara (JP)

Michael P. Belyansky of Halfmoon NY (US)

John Knickerbocker of Monroe NY (US)

Takashi Hisada of Hachiouji-shi (JP)

SILICON HANDLER WITH LASER-RELEASE LAYERS - A simplified explanation of the abstract

This abstract first appeared for US patent application 17541946 titled 'SILICON HANDLER WITH LASER-RELEASE LAYERS

Simplified Explanation

The patent application describes a method for handling wafers using a specialized handler. Here are the key points:

  • The handler is attached to the wafer using a bonding layer consisting of a debonding layer, an optical enhancement layer, and an anti-reflection layer.
  • To release the wafer, the handler is debonded using a laser that emits energy at a specific wavelength.
  • The debonding layer absorbs the laser energy, and the optical enhancement layer confines the energy to the debonding layer.
  • When exposed to the laser energy, the debonding layer material ablates, allowing the wafer to be released.

Potential applications of this technology:

  • Semiconductor manufacturing: This method can be used to handle wafers during the manufacturing process, making it easier to manipulate and release them.
  • Wafer testing: The handler can be used to securely hold wafers during testing, ensuring accurate and reliable results.

Problems solved by this technology:

  • Delicate handling: The specialized handler provides a secure and controlled way to handle wafers, reducing the risk of damage or contamination.
  • Efficient release: The use of laser energy allows for a quick and precise release of the wafer from the handler, improving overall efficiency.

Benefits of this technology:

  • Improved manufacturing process: The method simplifies the handling of wafers, making the manufacturing process more efficient and reliable.
  • Enhanced accuracy: The controlled release of the wafer ensures accurate positioning and testing, leading to better quality control.


Original Abstract Submitted

Handler wafers and methods of handling a wafer include positioning a handler, which is attached to a wafer by a bonding layer that comprises a debonding layer, an optical enhancement layer, and an anti-reflection layer. The handler is debonded from the wafer using a laser that emits laser energy at a wavelength that is absorbed by the debonding layer and that is confined to the debonding layer by the optical enhancement layer, such that the material of the debonding layer ablates when exposed to the laser energy to release the wafer.

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