View source for 17460908. CHIP PACKAGE STRUCTURE, CHIP STRUCTURE AND METHOD FOR FORMING CHIP STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

=CHIP PACKAGE STRUCTURE, CHIP STRUCTURE AND METHOD FOR FORMING CHIP STRUCTURE=


==Organization Name==

[[:Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.|TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]


[[Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]

==Inventor(s)==

[[:Category:Chien-Cheng Chen of Hsinchu County (TW)|Chien-Cheng Chen of Hsinchu County (TW)]][[Category:Chien-Cheng Chen of Hsinchu County (TW)]]

[[:Category:Pei-Haw Tsao of Nan-Chu (TW)|Pei-Haw Tsao of Nan-Chu (TW)]][[Category:Pei-Haw Tsao of Nan-Chu (TW)]]

==CHIP PACKAGE STRUCTURE, CHIP STRUCTURE AND METHOD FOR FORMING CHIP STRUCTURE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17460908 titled 'CHIP PACKAGE STRUCTURE, CHIP STRUCTURE AND METHOD FOR FORMING CHIP STRUCTURE

==Simplified Explanation==

The abstract describes a chip structure that includes a substrate, an interconnect layer, a conductive pad, and a conductive bump. The conductive bump has a first portion, a second portion, and a narrower neck portion between them.

* The chip structure includes a substrate, interconnect layer, conductive pad, and conductive bump.
* The conductive bump has a first portion, a second portion, and a narrower neck portion.
* The first portion is located between the neck portion and the conductive pad.
* The neck portion is narrower than both the first and second portions.

Potential Applications:
* Integrated circuits
* Semiconductor devices
* Electronic components

Problems Solved:
* Provides a chip structure with improved interconnectivity and conductivity.
* Allows for more efficient transmission of electrical signals.

Benefits:
* Enhanced performance of integrated circuits and semiconductor devices.
* Improved reliability and functionality of electronic components.
* Enables miniaturization of electronic devices.


==Original Abstract Submitted==

A chip structure is provided. The chip structure includes a substrate. The chip structure includes an interconnect layer over the substrate. The chip structure includes a conductive pad over the interconnect layer. The chip structure includes a conductive bump over the conductive pad. The conductive bump has a first portion, a second portion, and a neck portion between the first portion and the second portion. The first portion is between the neck portion and the conductive pad. The neck portion is narrower than the first portion and narrower than the second portion.



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