View source for 17424475. DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)

=DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE=


==Organization Name==

[[:Category:BOE TECHNOLOGY GROUP CO., LTD.|BOE TECHNOLOGY GROUP CO., LTD.]]


[[Category:BOE TECHNOLOGY GROUP CO., LTD.]]

==Inventor(s)==

[[:Category:Li Jia of Beijing (CN)|Li Jia of Beijing (CN)]][[Category:Li Jia of Beijing (CN)]]

[[:Category:Tao Gao of Beijing (CN)|Tao Gao of Beijing (CN)]][[Category:Tao Gao of Beijing (CN)]]

[[:Category:Zubin Lv of Beijing (CN)|Zubin Lv of Beijing (CN)]][[Category:Zubin Lv of Beijing (CN)]]

==DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17424475 titled 'DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

==Simplified Explanation==

The patent application describes a display substrate and a method for manufacturing the display substrate. The display substrate includes a substrate film layer and functional film layers, and it has a display region and a hole-forming region. The method involves several steps, including forming functional film layers, etching to create via-holes, and removing a transition layer.

* The display substrate includes a substrate film layer and functional film layers.
* The display substrate has a display region and a hole-forming region.
* The method involves forming functional film layers on the substrate film layer.
* At least one of the functional film layers in the hole-forming region is etched to create a first via-hole.
* A transition layer is formed to cover the display region and reveal the first via-hole.
* A second via-hole is formed in the hole-forming region using the transition layer as a mask.
* The second via-hole penetrates the substrate film layer and all the functional film layers except the one that was etched.
* The transition layer is then removed.

==Potential Applications==
This technology can be applied in various display devices, such as LCD screens, OLED displays, and touchscreens. It can also be used in electronic devices that require precise and efficient connection between different layers.

==Problems Solved==
The method described in the patent application solves the problem of creating via-holes in a display substrate with multiple functional film layers. It provides a simplified and efficient process for forming via-holes, allowing for better connectivity and functionality in display devices.

==Benefits==
The use of this technology offers several benefits:
* Simplified manufacturing process for display substrates.
* Improved connectivity between different layers in the display substrate.
* Enhanced functionality and performance of display devices.
* Cost-effective production of display substrates.


==Original Abstract Submitted==

A display substrate, a method for manufacturing the display substrate and a display device are provided in this disclosure. The display substrate includes a substrate film layer and functional film layers, the display substrate includes a display region and a hole-forming region, and the method includes: forming a plurality of functional film layers on the substrate film layer; etching at least one of the functional film layers in the hole-forming region to form a first via-hole penetrating the at least one of the functional film layers; forming a transition layer that covers the display region and reveals the first via-hole; forming a second via-hole in the hole-forming region by using the transition layer as a mask, the second via-hole penetrating the substrate film layer and all the functional film layers apart from the at least one of the functional film layers; and removing the transition layer.



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