17397398. Millimeter-Wave Antenna Module and Electronic Device simplified abstract (GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.)
Contents
- 1 Millimeter-Wave Antenna Module and Electronic Device
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 Millimeter-Wave Antenna Module and Electronic Device - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
Millimeter-Wave Antenna Module and Electronic Device
Organization Name
GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
Inventor(s)
Millimeter-Wave Antenna Module and Electronic Device - A simplified explanation of the abstract
This abstract first appeared for US patent application 17397398 titled 'Millimeter-Wave Antenna Module and Electronic Device
Simplified Explanation
The millimeter-wave antenna module described in the patent application is designed for use in electronic devices and comprises an antenna array, a feeding module, and a buffer layer. The antenna array is responsible for receiving or transmitting millimeter-wave signals, while the feeding module provides coupled feeding to the antenna array. The buffer layer, with a dielectric constant greater than that of air and less than that of the rear housing, is positioned between the antenna array and the feeding module.
- Antenna array for receiving or transmitting millimeter-wave signals
- Feeding module for coupled feeding to the antenna array
- Buffer layer with specific dielectric constant for insulation and signal transmission optimization
Potential Applications
The technology described in the patent application could be applied in various electronic devices requiring millimeter-wave communication capabilities, such as 5G smartphones, IoT devices, and radar systems.
Problems Solved
This technology solves the problem of efficiently transmitting and receiving millimeter-wave signals in electronic devices while maintaining signal integrity and minimizing interference.
Benefits
The benefits of this technology include improved millimeter-wave signal reception and transmission, reduced signal interference, and optimized performance of electronic devices in terms of communication speed and reliability.
Potential Commercial Applications
The potential commercial applications of this technology include the integration of millimeter-wave antenna modules in 5G smartphones, IoT devices for smart homes, and radar systems for defense and security purposes.
Possible Prior Art
One possible prior art for this technology could be the use of similar millimeter-wave antenna modules in previous electronic devices or communication systems, although specific details may vary.
Unanswered Questions
How does the buffer layer impact the overall performance of the millimeter-wave antenna module?
The buffer layer with a specific dielectric constant is crucial for optimizing signal transmission and insulation within the antenna module. However, the exact impact of the buffer layer on the overall performance, such as signal strength or interference reduction, is not explicitly mentioned in the abstract.
What specific electronic devices could benefit the most from this millimeter-wave antenna module technology?
While the abstract mentions electronic devices in general, it does not specify which types of devices could benefit the most from this technology. Understanding the specific applications and potential advantages for different devices could provide valuable insights into the market potential of this innovation.
Original Abstract Submitted
Provided are a millimeter-wave antenna module and an electronic device. The electronic device comprises a rear housing, a main circuit board disposed apart from and faced to the rear housing, and the millimeter-wave antenna module. The millimeter-wave antenna module comprises: an antenna array, disposed on the rear housing and configured to receive or transmit millimeter-wave signals; a feeding module, disposed between the rear housing and the main circuit board, and arranged opposite to the antenna array, wherein the feeding module is connected to the main circuit board, and configured to perform coupled feeding to the antenna array; and a buffer layer, disposed between the antenna array and the feeding module, and having a dielectric constant greater than that of air and less than that of the rear housing.
