US Patent Application 18355379. PACKAGE AND MANUFACTURING METHOD THEREOF simplified abstract
Contents
PACKAGE AND MANUFACTURING METHOD THEREOF
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Yung-Chi Chu of Kaohsiung City (TW)
Hung-Jui Kuo of Hsinchu City (TW)
Yu-Hsiang Hu of Hsinchu City (TW)
Sih-Hao Liao of New Taipei City (TW)
PACKAGE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18355379 titled 'PACKAGE AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The patent application describes a package that includes a die, an encapsulant, and a redistribution structure.
- The die is laterally encapsulated by the encapsulant.
- The redistribution structure is placed over the die and the encapsulant.
- The redistribution structure partially exposes the die.
- The top surface of the redistribution structure is slanted downward continuously from an edge of the package towards the interior of the package.
Original Abstract Submitted
A package includes a die, an encapsulant, and a redistribution structure. The encapsulant laterally encapsulates the die. The redistribution structure is over the die and the encapsulant. The redistribution structure partially exposes the die. A top surface of the redistribution structure is slanted downward continuously from an edge of the package toward an interior of the package.
