US Patent Application 18095642. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract
Contents
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
Hyungjun Park of Suwon-si (KR)
Sangyeol Choi of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18095642 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The patent application describes a semiconductor package and a method of manufacturing it.
- The semiconductor package is designed to maximize heat dissipation efficiency.
- It includes a first redistribution substrate, a first semiconductor chip, and a plurality of through posts.
- The first semiconductor chip is placed on the first redistribution substrate.
- The through posts are located around the first semiconductor chip on the first redistribution substrate.
- The package also includes a second redistribution substrate that is positioned over the first semiconductor chip and the through posts.
- The top surface of the first semiconductor chip is in contact with the bottom surface of the second redistribution substrate.
Original Abstract Submitted
Provided are a semiconductor package having a structure maximizing heat dissipation efficiency and a method of manufacturing the same. The semiconductor package includes a first redistribution substrate, a first semiconductor chip on the first redistribution substrate, a plurality of through posts on the first redistribution substrate, around the first semiconductor chip, and a second redistribution substrate located over the first semiconductor chip and the through posts, wherein a top surface of the first semiconductor chip is in contact with a bottom surface of the second redistribution substrate.
