US Patent Application 18119705. PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
Contents
PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
HYEONJEONG Hwang of Suwon-si (KR)
HYEONSEOK Lee of Suwon-si (KR)
PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18119705 titled 'PACKAGE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The patent application describes a package and its fabrication methods.
- The package consists of a lower substrate with an upper pad.
- A lower chip is placed on the lower substrate.
- A mold layer is applied on the lower chip and the lower substrate.
- A post is inserted through the mold layer and placed on the upper pad around the lower chip.
- The post has a smaller diameter than the upper pad.
- An upper substrate is placed on the post and the mold layer.
- The upper substrate includes a lower pad with a larger diameter than the post.
Original Abstract Submitted
Disclosed are packages and their fabrication methods. The package includes: a lower substrate with an upper pad; a lower chip on the lower substrate; a mold layer on the lower chip and the lower substrate; a post extending through the mold layer and provided on the upper pad around the lower chip, the post having a diameter less than a diameter of the upper pad; and an upper substrate on the post and the mold layer, the upper substrate including a lower pad having a diameter greater than the diameter of the post.
