18379841. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Organization Name
Inventor(s)
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18379841 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Simplified Explanation
The semiconductor package described in the patent application includes a redistribution structure, a semiconductor chip, a molding layer, and a silicon heat dissipation structure bonded to the semiconductor chip through silicon-to-silicon direct bonding.
- The redistribution structure consists of a redistribution pattern and a redistribution insulation layer.
- The semiconductor chip is positioned on the redistribution structure and has an active surface and an inactive surface.
- The molding layer covers at least a portion of the semiconductor chip.
- The silicon heat dissipation structure is placed on the semiconductor chip and is directly bonded to it through silicon-to-silicon bonding.
Potential Applications
This technology could be applied in:
- High-performance computing devices
- Automotive electronics
- Aerospace systems
Problems Solved
This technology addresses issues related to:
- Heat dissipation in semiconductor devices
- Enhanced performance and reliability of electronic components
Benefits
The benefits of this technology include:
- Improved thermal management
- Increased efficiency and longevity of semiconductor devices
- Enhanced overall performance of electronic systems
Potential Commercial Applications
Potential commercial applications of this technology could be seen in:
- Consumer electronics
- Telecommunications equipment
- Medical devices
Possible Prior Art
One possible prior art could be the use of traditional heat dissipation methods such as heat sinks or fans in semiconductor devices.
Unanswered Questions
How does the direct silicon-to-silicon bonding improve heat dissipation compared to other methods?
The direct bonding of the silicon heat dissipation structure to the semiconductor chip allows for efficient heat transfer due to the high thermal conductivity of silicon.
Are there any limitations to the direct silicon-to-silicon bonding method in terms of scalability or cost?
While silicon-to-silicon bonding is effective for heat dissipation, there may be challenges in scaling up production or potential cost implications that need to be considered.
Original Abstract Submitted
Provided is a semiconductor package comprising a redistribution structure including a redistribution pattern and a redistribution insulation layer covering the redistribution pattern, a semiconductor chip disposed on the redistribution structure and having an active surface and an inactive surface opposite to the active surface, a molding layer disposed on the redistribution structure and covering at least a portion of the semiconductor chip, and a silicon heat dissipation structure disposed on the semiconductor chip, wherein the silicon heat dissipation structure is bonded to the semiconductor chip through silicon (Si)-to-Si direct bonding.
