Micron technology, inc. (20240128163). SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES FOR DECOUPLING CAPACITORS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS simplified abstract

SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES FOR DECOUPLING CAPACITORS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS

Organization Name

micron technology, inc.

Inventor(s)

Hong Wan Ng of Singapore (SG)

Chin Hui Chong of Singapore (SG)

Hem P. Takiar of Fremont CA (US)

Seng Kim Ye of Singapore (SG)

Kelvin Tan Aik Boo of Singapore (SG)

SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES FOR DECOUPLING CAPACITORS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240128163 titled 'SUBSTRATES FOR SEMICONDUCTOR PACKAGES, INCLUDING HYBRID SUBSTRATES FOR DECOUPLING CAPACITORS, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS

Simplified Explanation

The patent application describes substrates for semiconductor packages, including hybrid substrates for decoupling capacitors. Here are some key points from the abstract:

• Substrates include a first pair and a second pair of electrical contacts on a first surface.
• The first pair of contacts is for a first surface-mount capacitor, and the second pair is for a second surface-mount capacitor.
• The pairs of contacts are spaced apart by specific distances corresponding to the capacitors.

Potential Applications

The technology described in the patent application could be applied in various semiconductor packaging applications where decoupling capacitors are needed to improve performance and reduce noise.

Problems Solved

This technology solves the problem of efficiently integrating decoupling capacitors into semiconductor packages, providing a more compact and effective solution compared to traditional methods.

Benefits

The benefits of this technology include improved performance, reduced noise, space-saving design, and potentially lower manufacturing costs.

Potential Commercial Applications

One potential commercial application of this technology could be in the production of high-performance electronic devices such as smartphones, tablets, and other consumer electronics.

Possible Prior Art

One possible prior art could be the use of traditional decoupling capacitor integration methods in semiconductor packages.

How does this technology compare to existing methods of integrating decoupling capacitors in semiconductor packages?

This article does not provide a direct comparison to existing methods, leaving the reader to wonder about the specific advantages and disadvantages of this new approach.

What specific manufacturing processes are required to implement this technology in semiconductor packages?

The article does not delve into the details of the manufacturing processes involved, leaving a gap in understanding for readers interested in the practical implementation of this innovation.

Original Abstract Submitted

substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods are disclosed herein. in one embodiment, a substrate includes a first pair and a second pair of electrical contacts on a first surface of the substrate. the first pair of electrical contacts can be configured to receive a first surface-mount capacitor, and the second pair of electrical contacts can be configured to receive a second surface-mount capacitor. the first pair of electrical contacts can be spaced apart by a first space, and the second pair of electrical contacts can be spaced apart by a second space. the first and second spaces can correspond to corresponding to first and second distances between electrical contacts of the first and second surface-mount capacitors.