Toyota jidosha kabushiki kaisha (20240133068). FILM FORMING METHOD FOR FORMING METAL FILM simplified abstract
Contents
- 1 FILM FORMING METHOD FOR FORMING METAL FILM
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 FILM FORMING METHOD FOR FORMING METAL FILM - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
FILM FORMING METHOD FOR FORMING METAL FILM
Organization Name
toyota jidosha kabushiki kaisha
Inventor(s)
Haruki Kondoh of Okazaki-shi (JP)
Keiji Kuroda of Toyota-shi (JP)
Koji Inagaki of Toyota-shi (JP)
FILM FORMING METHOD FOR FORMING METAL FILM - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240133068 titled 'FILM FORMING METHOD FOR FORMING METAL FILM
Simplified Explanation
The method described in the patent application involves a process for electroplating a metal film onto a substrate using a screen mask and an electrolyte membrane. Here is a simplified explanation of the abstract:
- Placing a substrate on a mount base
- Covering the substrate with a screen mask that has a predetermined pattern
- Pressing the substrate with an electrolyte membrane and a plating solution
- Applying a voltage between an anode and the substrate to allow metal ions to pass through the electrolyte membrane and form a metal film on the substrate in the predetermined pattern
- A cushion member is disposed along the outer edge portion of the substrate before pressing
Potential Applications
This technology could be used in the manufacturing of electronic devices, such as circuit boards, where precise metal patterning is required.
Problems Solved
This method solves the problem of accurately depositing metal films onto substrates with complex patterns, which can be challenging using traditional plating methods.
Benefits
The benefits of this technology include improved precision and efficiency in metal plating processes, leading to higher quality electronic components.
Potential Commercial Applications
The potential commercial applications of this technology could include the production of advanced electronic devices, medical devices, and other high-tech products that require precise metal patterning.
Possible Prior Art
One possible prior art for this technology could be the use of screen printing techniques in the manufacturing industry for applying patterns onto substrates.
Unanswered Questions
How does this method compare to traditional metal plating techniques in terms of cost and efficiency?
This article does not provide a direct comparison between this method and traditional metal plating techniques.
What are the environmental implications of using this technology compared to other metal plating methods?
The article does not address the environmental impact of this technology in comparison to other metal plating methods.
Original Abstract Submitted
the method includes: placing a substrate on a mount base; covering the substrate with the screen mask including a penetrating portion of a predetermined pattern; pressing the substrate by the electrolyte membrane with a fluid pressure of a plating solution contacting the electrolyte membrane via the screen mask; and applying a voltage between an anode contacting the plating solution and the substrate so as to allow metal ions contained in the plating solution to pass through the electrolyte membrane and form a metal film derived from the metal ions in the predetermined pattern on the substrate. the substrate includes an outer edge portion formed by an opposite surface facing the screen mask and a side surface. a cushion member is disposed along the outer edge portion before pressing the substrate.
