Dell products l.p. (20240130041). INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HAVING NON-HOMOGENEOUS SUBSTRATE MATERIAL AND INTEGRATED THERMAL SOLUTION simplified abstract
Contents
- 1 INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HAVING NON-HOMOGENEOUS SUBSTRATE MATERIAL AND INTEGRATED THERMAL SOLUTION
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HAVING NON-HOMOGENEOUS SUBSTRATE MATERIAL AND INTEGRATED THERMAL SOLUTION - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.9.1 Unanswered Questions
- 1.9.2 How does the removal of the bio-based substrate impact the overall performance and longevity of the electronic components and sensors in the system?
- 1.9.3 What are the potential challenges or limitations of reusing the prepreg substrate with updated bio-based substrates?
- 1.10 Original Abstract Submitted
INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HAVING NON-HOMOGENEOUS SUBSTRATE MATERIAL AND INTEGRATED THERMAL SOLUTION
Organization Name
Inventor(s)
Peng Lip Goh of Singapore (SG)
Deeder M. Aurongzeb of Austin TX (US)
INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HAVING NON-HOMOGENEOUS SUBSTRATE MATERIAL AND INTEGRATED THERMAL SOLUTION - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240130041 titled 'INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HAVING NON-HOMOGENEOUS SUBSTRATE MATERIAL AND INTEGRATED THERMAL SOLUTION
Simplified Explanation
The patent application describes an information handling system and/or peripheral device that utilizes a combination of bio-based substrates and prepreg substrates, with a layer of graphene in between, to support electronic components and sensors. The bio-based substrate can be removed at the end of life, allowing the prepreg substrate to be reused.
- The system includes a printed circuit board with at least one prepreg substrate coupled to at least one bio-based substrate.
- A layer of graphene is positioned between the prepreg substrate and the bio-based substrate.
- The bio-based substrate can be removed, such as by melting, at the end of life to enable the reuse of the prepreg substrate.
- In one embodiment, the prepreg substrate supports power and ground planes that bio-based substrates couple over, allowing for the reuse of the prepreg substrate along with the power and ground planes by coupling updated bio-based substrates over it.
Potential Applications
This technology could be applied in the development of more sustainable and environmentally friendly electronic devices and peripherals.
Problems Solved
This technology addresses the issue of electronic waste by allowing for the reuse of the prepreg substrate and reducing the environmental impact of disposing of electronic components.
Benefits
The use of bio-based substrates and the ability to reuse the prepreg substrate contribute to a more sustainable approach to electronic device manufacturing.
Potential Commercial Applications
This technology could be utilized in the production of eco-friendly computer peripherals, mobile devices, and other electronic products.
Possible Prior Art
One possible prior art could be the use of bio-based materials in electronic device manufacturing to reduce environmental impact. However, the specific combination of bio-based and prepreg substrates with graphene as described in this patent application may be a novel approach.
Unanswered Questions
How does the removal of the bio-based substrate impact the overall performance and longevity of the electronic components and sensors in the system?
The article does not provide information on how the removal of the bio-based substrate affects the performance and longevity of the electronic components and sensors in the system. Further research or testing may be needed to determine the impact of this process on the functionality of the device.
What are the potential challenges or limitations of reusing the prepreg substrate with updated bio-based substrates?
The article does not address any potential challenges or limitations that may arise when reusing the prepreg substrate with updated bio-based substrates. It would be important to consider factors such as compatibility, durability, and performance when implementing this recycling process.
Original Abstract Submitted
an information handling system and/or peripheral device includes a printed circuit board having at least one prepreg substrate coupled to at least one bio-based substrate to support operation of electronic components, such as mouse position sensor and scroll wheel rotation sensor, and having a layer of graphene between the prepreg substrate and the bio-based substrate. at end of life, the bio-based substrate is removed from the prepreg substrate, such as by melting of the biobased material, so that the prepreg substrate can be reused. in one embodiment, the prepreg substrate supports power and ground planes that bio-based substrates couple over so that the prepreg substrate can be reused along with the power and ground planes by coupling updated bio-based substrates over the reused prepreg substrate.
