Samsung electronics co., ltd. (20240136250). SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE simplified abstract
Contents
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE
Organization Name
Inventor(s)
Hyeonjeong Hwang of Suwon-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240136250 titled 'SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION STRUCTURE
Simplified Explanation
The present disclosure describes semiconductor packages with a heat dissipation structure, including a package substrate, a stacked chip with a lower and upper chip, a memory chip, and an encapsulant. The upper surface of the upper chip is exposed, and a dummy silicon chip is in contact with the upper chip on the lower chip.
- Explanation of the patent/innovation:
- Semiconductor packages with a heat dissipation structure - Stacked chip design with lower and upper chips - Memory chip adjacent to the stacked chip - Exposed upper surface of the upper chip - Dummy silicon chip in contact with the upper chip on the lower chip
Potential applications of this technology: - High-performance computing - Data centers - Automotive electronics - Consumer electronics
Problems solved by this technology: - Improved heat dissipation in semiconductor packages - Enhanced performance of stacked chip designs - Efficient memory chip integration
Benefits of this technology: - Better thermal management - Increased reliability and longevity of semiconductor devices - Compact design for space-constrained applications
Potential commercial applications of this technology: - Semiconductor manufacturing companies - Electronics manufacturers - Technology companies
Possible prior art: - Previous semiconductor package designs with heat dissipation structures - Stacked chip configurations in semiconductor devices
Questions: 1. How does the heat dissipation structure in this semiconductor package improve overall performance? 2. What specific materials are used in the encapsulant to ensure effective heat dissipation?
Original Abstract Submitted
the present disclosure provides semiconductor packages including a heat dissipation structure. in some embodiments, the semiconductor package includes a package substrate, a stacked chip disposed on the package substrate and including a lower chip and an upper chip, a memory chip disposed on the package substrate adjacent to the stacked chip, and an encapsulant encapsulating at least a portion of the stacked chip and the memory chip on the package substrate. an upper surface of the upper chip is exposed from the encapsulant. a dummy silicon chip is in contact with the upper chip on the lower chip.
