Samsung electronics co., ltd. (20240128173). SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Organization Name
Inventor(s)
Choong Bin Yim of Suwon-si (KR)
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128173 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Simplified Explanation
The semiconductor package described in the abstract includes a first package substrate with distinct regions, connection elements of varying heights, semiconductor chips, and a mold layer covering certain components while exposing others.
- The first package substrate is divided into a first region and a second region.
- A first connection element with a first height is located on the first region.
- A first semiconductor chip with a second height is connected to the first connection element.
- A second connection element with a third height is situated on the second region.
- A third connection element with a fourth height is electrically connected to the second connection element.
- A second package, consisting of a second package substrate and a second semiconductor chip, is placed on the third connection element.
- A first mold layer covers parts of the first semiconductor chip, the second connection element, and the first package substrate, while exposing upper surfaces of the first semiconductor chip and the second connection element, with a fifth height.
Potential Applications
The technology described in this patent application could be used in various electronic devices, such as smartphones, tablets, laptops, and other consumer electronics that require semiconductor packages with multiple components.
Problems Solved
This technology addresses the need for efficient and reliable semiconductor packaging solutions that can accommodate multiple components with varying heights and connection requirements.
Benefits
The benefits of this technology include improved performance, enhanced durability, and increased flexibility in designing semiconductor packages for different applications.
Potential Commercial Applications
The potential commercial applications of this technology could be in the semiconductor industry, electronics manufacturing, and other sectors that rely on advanced packaging solutions for their products.
Possible Prior Art
One possible prior art in semiconductor packaging technology is the use of stacked die packages, where multiple semiconductor chips are stacked on top of each other to save space and improve performance.
Unanswered Questions
How does this technology compare to existing semiconductor packaging solutions in terms of cost-effectiveness?
The cost-effectiveness of this technology compared to existing solutions is not addressed in the abstract. Further research or analysis would be needed to determine the cost implications of implementing this innovation.
What impact does the mold layer have on the overall performance and reliability of the semiconductor package?
The abstract mentions a mold layer covering certain components, but it does not elaborate on the specific impact of this layer on the performance and reliability of the semiconductor package. Additional information or testing would be required to assess the significance of the mold layer in this context.
Original Abstract Submitted
a semiconductor package includes a first package substrate having a first region and a second region, which do not overlap each other, a first connection element having a first height on the first region, a first semiconductor chip having a second height connected to the first connection element, a second connection element having a third height on the second region, a third connection element having a fourth height on the second connection element and electrically connected to the second connection element, a second package on the third connection element, the second package including a second package substrate and a second semiconductor chip, and a first mold layer covering at least a portion of the first semiconductor chip, covering at least a portion of the second connection element, covering the first package substrate, exposing upper surfaces of the first semiconductor chip and the second connection element, and having a fifth height.
