Samsung electronics co., ltd. (20240128145). SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME simplified abstract
Contents
- 1 SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
Organization Name
Inventor(s)
HYEONSEOK Lee of SUWON-SI (KR)
HYEONJEONG Hwang of SUWON-SI (KR)
SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240128145 titled 'SEMICONDUCTOR PACKAGES AND METHOD FOR FABRICATING THE SAME
Simplified Explanation
The semiconductor package described in the patent application includes a redistribution substrate, a sub-package, a semiconductor chip, a heat dissipation structure, and an encapsulant. The redistribution substrate contains a redistribution structure, with the semiconductor chip positioned next to the sub-package. The encapsulant covers the sub-package, semiconductor chip, and heat dissipation structure.
- Redistribution substrate with redistribution structure
- Sub-package and semiconductor chip positioned side-by-side
- Heat dissipation structure surrounding sub-package and semiconductor chip
- Encapsulant covering sub-package, semiconductor chip, and heat dissipation structure
Potential Applications
The technology described in this patent application could be applied in various electronic devices requiring efficient heat dissipation, such as smartphones, tablets, laptops, and other portable electronic devices.
Problems Solved
This technology solves the problem of heat buildup in semiconductor packages, which can affect the performance and longevity of electronic devices. By incorporating a heat dissipation structure, this innovation helps in dissipating heat effectively, ensuring optimal performance.
Benefits
The benefits of this technology include improved thermal management, enhanced performance of electronic devices, increased longevity of semiconductor packages, and overall better user experience with electronic products.
Potential Commercial Applications
- "Enhanced Heat Dissipation Technology for Electronic Devices"
Possible Prior Art
One possible prior art could be the use of heat sinks or fans in electronic devices to manage heat dissipation. However, the specific configuration and integration of the heat dissipation structure in this semiconductor package may be a novel aspect not found in existing technologies.
Unanswered Questions
How does the heat dissipation structure improve the overall performance of the semiconductor package?
The article does not delve into the specific mechanisms through which the heat dissipation structure enhances the performance of the semiconductor package.
What materials are used in the construction of the heat dissipation structure?
The article does not provide information on the specific materials utilized in the heat dissipation structure.
Original Abstract Submitted
a semiconductor package includes a redistribution substrate, a sub-package disposed on the redistribution substrate, a semiconductor chip disposed on the redistribution substrate, a heat dissipation structure disposed on the redistribution substrate and surrounding the sub-package and the semiconductor chip, and an encapsulant. the redistribution substrate includes a redistribution structure. the semiconductor chip is positioned side-by-side with the sub-package. the encapsulant encapsulates the sub-package, the semiconductor chip, and the heat dissipation structure.
