18468174. Packaged Device, Packaged Module, and Power Conversion Device simplified abstract (Huawei Digital Power Technologies Co., Ltd.)

Packaged Device, Packaged Module, and Power Conversion Device

Organization Name

Huawei Digital Power Technologies Co., Ltd.

Inventor(s)

Dong Chen of Shanghai (CN)

Fenglong Lu of Shanghai (CN)

Yunyu Tang of Shanghai (CN)

Lei Shi of Shanghai (CN)

Yunfeng Liu of Shanghai (CN)

Shuyi Lv of Shanghai (CN)

Pengcheng Zhang of Shanghai (CN)

Packaged Device, Packaged Module, and Power Conversion Device - A simplified explanation of the abstract

This abstract first appeared for US patent application 18468174 titled 'Packaged Device, Packaged Module, and Power Conversion Device

Simplified Explanation

The abstract describes a packaged device that includes a circuit board, an electronic component, and a heat storage portion. The heat storage portion, with a higher specific heat capacity than the circuit board, is designed to store and release heat generated by the electronic component.

• The electronic component is electrically coupled to the circuit board.
• The heat storage portion is adjacent to the electronic component and can be disposed on or embedded in the circuit board.
• A heat storage material with a high specific heat capacity is introduced into the device to efficiently store and release heat.

Potential Applications

This technology could be applied in electronic devices, such as smartphones, laptops, or servers, to manage and dissipate heat effectively.

Problems Solved

1. Overheating issues in electronic devices can be mitigated by efficiently storing and releasing heat. 2. Ensuring the longevity and performance of electronic components by managing heat effectively.

Benefits

1. Improved thermal management in electronic devices. 2. Enhanced reliability and performance of electronic components. 3. Increased lifespan of electronic devices.

Potential Commercial Applications

Optimizing thermal management in consumer electronics for improved performance and longevity.

Possible Prior Art

One possible prior art could be the use of heat sinks or fans in electronic devices to dissipate heat. However, the specific approach of using a heat storage portion with a high specific heat capacity to store and release heat efficiently may be a novel innovation.

How does this technology compare to traditional cooling methods like heat sinks and fans?

This technology offers a potentially more efficient way to manage heat in electronic devices compared to traditional cooling methods. It would be interesting to see a direct comparison of effectiveness and cost between the two approaches.

What impact could this technology have on the design and size of electronic devices?

The integration of a heat storage portion with high specific heat capacity may influence the design and size of electronic devices. Understanding the potential changes in form factor and design constraints would be crucial for further development and implementation of this technology.

Original Abstract Submitted

A packaged device includes a circuit board, an electronic component, and a heat storage portion. The electronic component is electrically coupled to the circuit board; and the heat storage portion is disposed on the circuit board or embedded in the circuit board, and the heat storage portion is adjacent to the electronic component, where a specific heat capacity of the heat storage portion is higher than a specific heat capacity of the circuit board, and the heat storage portion is configured to store and release heat. A heat storage material with a relatively high specific heat capacity is introduced into the packaged device, and the heat storage portion is disposed on the circuit board around the electronic component where a large amount of heat generated by the electronic component in a short time can be quickly stored in the heat storage portion and then released to the outside.