17945410. SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREOF simplified abstract (NANYA TECHNOLOGY CORPORATION)
SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREOF
Organization Name
Inventor(s)
Yi-Jen Lo of New Taipei City (TW)
SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 17945410 titled 'SEMICONDUCTOR STRUCTURE HAVING DUMMY CONDUCTIVE MEMBER AND MANUFACTURING METHOD THEREOF
Simplified Explanation
The present application provides a semiconductor structure with a dummy conductive member and a method for manufacturing the semiconductor structure. The structure includes a first wafer with a first substrate, a first dielectric layer, a first bonding layer, a first via, and a first dummy conductive member. It also includes a second wafer with a second bonding layer, a second via, a second dummy conductive member, a second dielectric layer, and a second substrate.
- Explanation of the patent:
- Semiconductor structure with dummy conductive members for improved performance. - Method for manufacturing the semiconductor structure with precise placement of dummy conductive members. - Utilizes multiple wafers and layers for enhanced functionality.
- Potential applications of this technology:
- Semiconductor devices - Integrated circuits - Microprocessors
- Problems solved by this technology:
- Improved electrical conductivity - Enhanced performance and reliability - Better heat dissipation
- Benefits of this technology:
- Higher efficiency - Increased durability - Enhanced overall performance
- Potential commercial applications of this technology:
- Electronics industry - Semiconductor manufacturing companies - Research and development firms
- Possible prior art:
- Previous semiconductor structures with dummy conductive members - Older methods of manufacturing semiconductor devices
Questions:
1. How does the placement of dummy conductive members impact the overall performance of the semiconductor structure? 2. What specific advantages does the use of multiple wafers and layers provide in this semiconductor structure?
Original Abstract Submitted
The present application provides a semiconductor structure having a dummy conductive member, and a manufacturing method of the semiconductor structure. The semiconductor structure includes a first wafer including a first substrate, a first dielectric layer over the first substrate, a first bonding layer over the first dielectric layer, a first via extending through the first bonding layer, and a first dummy conductive member disposed adjacent to the first via and extending partially through the first bonding layer; and a second wafer including a second bonding layer over the first bonding layer, a second via extending through the second bonding layer, a second dummy conductive member disposed adjacent to the second via and extending partially through the second bonding layer, a second dielectric layer over the second bonding layer, and a second substrate over the second dielectric layer.
