18076545. LOCALIZED HEATING DEVICE AND LOCALIZED HEATING SYSTEM HAVING THE SAME simplified abstract (INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE)
Contents
- 1 LOCALIZED HEATING DEVICE AND LOCALIZED HEATING SYSTEM HAVING THE SAME
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 LOCALIZED HEATING DEVICE AND LOCALIZED HEATING SYSTEM HAVING THE SAME - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Unanswered Questions
- 1.11 Original Abstract Submitted
LOCALIZED HEATING DEVICE AND LOCALIZED HEATING SYSTEM HAVING THE SAME
Organization Name
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor(s)
JUI-MEI Hsu of Zhubei City (TW)
YO-SUNG Lee of New Taipei (TW)
YI-JIUN Lin of Chiayi County (TW)
CHIH-CHIANG Weng of Taoyuan (TW)
LOCALIZED HEATING DEVICE AND LOCALIZED HEATING SYSTEM HAVING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18076545 titled 'LOCALIZED HEATING DEVICE AND LOCALIZED HEATING SYSTEM HAVING THE SAME
Simplified Explanation
The localized heating device described in the patent application includes a plasma deforming portion and a heating portion. The plasma deforming portion has an inlet end with a circular hole, an outlet end with an elongated hole, and a channel connecting the two. The heating portion, located at the outlet end, consists of two control covers separated by a slot. The plasma flow enters the channel through the circular hole, passes through the elongated hole, and reaches the slot.
- Plasma deforming portion with circular and elongated holes
- Heating portion with control covers and slot
- Plasma flow enters through circular hole, flows through elongated hole, and reaches slot
Potential Applications
The technology could be used in industrial heating processes, such as in the manufacturing of materials that require localized heating.
Problems Solved
The device provides a controlled and localized heating method, which can be more efficient and precise compared to traditional heating methods.
Benefits
- Precise and controlled heating - Energy efficiency - Potential for automation in heating processes
Potential Commercial Applications
Optimizing Localized Heating Device for Industrial Processes
Possible Prior Art
There may be prior art related to plasma heating devices or localized heating methods, but specific examples are not provided in the patent application.
Unanswered Questions
How does the device handle different types of materials for heating?
The patent application does not specify how the device can be adapted for heating various materials with different properties.
What is the expected lifespan of the device and how easy is it to maintain?
Information regarding the durability and maintenance requirements of the device is not included in the patent application.
Original Abstract Submitted
A localized heating device includes a plasma deforming portion and a heating portion. The plasma deforming portion includes an inlet end having a circular hole, an outlet end having an elongated hole with a first length and a first width, and a channel smoothly connected with the circular hole and the elongated hole. The heating portion, disposed at the outlet end, includes two control covers spaced by a slot. The elongated hole and the slot being oppositely disposed with respect to the plasma deforming portion. A plasma flow provided by a plasma producing source being to enter the channel via the circular hole, then to flow through the elongated hole, and finally to reach the slot.
