18974221. SEMICONDUCTOR DEVICE (Rohm Co., Ltd.)
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Masaaki Matsuo of Kyoto-shi JP
SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 18974221 titled 'SEMICONDUCTOR DEVICE
Original Abstract Submitted
A semiconductor device includes an insulating layer, a conductive layer, a heat dissipation layer, a semiconductor element, and a bonding layer. The conductive layer includes an obverse surface facing away from the insulating layer in a first direction and is bonded to the insulating layer. The heat dissipation layer is located opposite to the conductive layer with respect to the insulating layer and bonded to the insulating layer. The semiconductor element is bonded to the obverse surface. The bonding layer bonds the obverse surface and the semiconductor element. The conductive layer is formed with a recess that is recessed from the obverse surface. The bonding layer includes a first portion located between the semiconductor element and the recess as viewed in the first direction, and the first portion covers the obverse surface.