Category:Rengarajan Shanmugam of Tempe AZ US
Rengarajan Shanmugam
Rengarajan Shanmugam from Tempe AZ US has applied for patents in technology areas such as H01L23/538, H01L21/48, H01L23/00 with intel corporation.
Patents
Pages in category "Rengarajan Shanmugam of Tempe AZ US"
The following 5 pages are in this category, out of 5 total.
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- Intel corporation (20250006646). THROUGH GLASS VIAS WITH COMPLIANT LAYER FOR INTEGRATED CIRCUIT DEVICE PACKAGES
- Intel corporation (20250106997). ELECTROLESS SEED LAYER DEPOSITION ON GLASS CORE SUBSTRATES
- Intel corporation (20250112163). THROUGH-GLASS VIA LINERS FOR INTEGRATED CIRCUIT DEVICE PACKAGES