Category:Xavier Brun of Hillsboro OR US
Xavier Brun
Xavier Brun from Hillsboro OR US has applied for patents in technology areas such as H01L23/538, H01L21/48, H01L23/00 with intel corporation.
Patents
Pages in category "Xavier Brun of Hillsboro OR US"
The following 5 pages are in this category, out of 5 total.
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- Intel corporation (20250006643). METHODS OF FORMING WAFER LEVEL MULTI-DIE SYSTEM FABRIC INTERCONNECT STRUCTURES
- Intel corporation (20250112177). SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID BONDED DIE STACKS
- Intel corporation (20250112181). BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS