18206201. SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES
Organization Name
Inventor(s)
Kwangseob Shin of Suwon-si (KR)
Junghwan Choi of Suwon-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES - A simplified explanation of the abstract
This abstract first appeared for US patent application 18206201 titled 'SEMICONDUCTOR PACKAGE INCLUDING BUFFER CHIP BONDED TO MEMORY DIES USING WIRES
Simplified Explanation
The abstract describes a semiconductor package that includes a buffer chip wire-bonded to memory dies in a stacked configuration.
- The semiconductor package consists of a semiconductor die stack with wire bonds connected to different sets of semiconductor dies.
- The buffer chip is positioned close to the semiconductor die stack and includes two sets of die bond pads - one set close to the stack and one set distant from the stack.
- Wire bonds extend from the second set of semiconductor dies to the first set of die bond pads on the buffer chip, and from the first set of semiconductor dies to the second set of die bond pads on the buffer chip.
- Potential Applications:**
- Memory modules
- Microprocessors
- Integrated circuits
- Problems Solved:**
- Efficient wire bonding in semiconductor packages
- Improved signal transmission between semiconductor dies and buffer chip
- Benefits:**
- Enhanced performance and reliability of semiconductor packages
- Compact design for space-saving applications
- Facilitates efficient communication between different components in the package
Original Abstract Submitted
A buffer chip is wire-bonded to memory dies. A semiconductor package includes a semiconductor die stack, a first set of wire bonds connected to a first set of semiconductor dies, a second set of wire bonds connected to a second set of semiconductor dies, and the buffer chip. The second set of semiconductor dies are on the first set of semiconductor dies. The buffer chip includes a first set of die bond pads being close to the semiconductor die stack, and a second set of die bond pads being distant from the semiconductor die stack. The second set of wire bonds extends to the first set of die bond pads of the buffer chip, and the first set of wire bonds extends to the second set of die bond pads of the buffer chip.
