18946965. SEMICONDUCTOR PACKAGE (Taiwan Semiconductor Manufacturing Company, LTD.)

SEMICONDUCTOR PACKAGE

Organization Name

Taiwan Semiconductor Manufacturing Company, LTD.

Inventor(s)

Chung-Ming Weng of Taichung City (TW)

Chen-Hua Yu of Hsinchu City (TW)

Chung-Shi Liu of Hsinchu City (TW)

Hao-Yi Tsai of Hsinchu City (TW)

Cheng-Chieh Hsieh of Tainan (TW)

Hung-Yi Kuo of Taipei City (TW)

Tsung-Yuan Yu of Taipei City (TW)

Hua-Kuei Lin of Hsinchu city (TW)

Hsiu-Jen Lin of Hsinchu County (TW)

Ming-Che Ho of Tainan City (TW)

Yu-Hsiang Hu of Hsinchu City (TW)

Chewn-Pu Jou of Hsinchu (TW)

Cheng-Tse Tang of Hsinchu (TW)

SEMICONDUCTOR PACKAGE

This abstract first appeared for US patent application 18946965 titled 'SEMICONDUCTOR PACKAGE

Original Abstract Submitted

A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.